Manager, Manufacturing Process Engineering

Teledyne Technologies Incorporated; Garland (TX); On-site; USD 130,000 - 190,000; Full time

Benefits offered by this job

Competitive salary

Health coverage

Dental coverage

Vision coverage

Retirement plan

Paid time off

Growth opportunities

Culture of innovation

Job summary

Teledyne Micropac is hiring a Manager of Manufacturing Process Engineering to lead a team of process and equipment engineers for high‑reliability semiconductor, hybrid microcircuit, and optoelectronic device manufacturing. You will drive process optimization and serve as the primary escalation point for complex issues.

You will guide semiconductor manufacturing processes, validate changes, and ensure documentation and quality systems are maintained.

Qualifications

• Bachelor’s degree in Engineering or 15+ years of directly relevant manufacturing/engineering experience.
• 7+ years in semiconductor, microelectronics, or aerospace manufacturing - required
• Strong knowledge of microcircuit assembly processes and high‑reliability standards - required
• Hands‑on experience with equipment troubleshooting, metrology, SPC, and DOE - required
• Experience leading technical teams in production environments - required
• Excellent communication and analytical skills - required
• Ability to develop engineering talent - required

Responsibilities

• Serve as the primary technical escalation point for equipment failures, process deviations, yield excursions, and customer-driven investigations.
• Lead structured problem-solving and ensure high‑quality root‑cause analysis.
• Provide guidance on semiconductor, microelectronics, and optoelectronic manufacturing processes.
• Troubleshoot and optimize automated and semi‑automated production equipment.
• Validate process changes through IQ/OQ/PQ, capability studies, and DOEs.
• Own critical manufacturing processes, ensuring stability, capability, and documentation.
• Maintain and improve SOPs, travelers, PFMEAs, control plans, and specifications.
• Ensure strong document control aligned with AS9100 and aerospace/military standards.
• Drive continuous improvement to reduce scrap, improve yields, and enhance throughput.
• Support lifecycle management of critical equipment and obsolescence planning.
• Coordinate with Facilities and Maintenance to maximize equipment uptime.
• Manage and develop a team of process and equipment engineers.
• Assign daily priorities and coach engineers to build technical capability.
• Promote disciplined engineering practices and data‑driven decision‑making.
• Manage performance reviews, training plans, and succession development.
• Partner with Operations, Quality, Planning, Continuous Improvement, and Program Management.
• Participate in audits, technical reviews, and customer discussions.

Skills

Semiconductor manufacturing

Microelectronics

Team leadership

Problem solving

Analytical skills

Communication skills

DOE

SPC

Equipment troubleshooting

CAPEX management

AS9100 knowledge

Education

Bachelor’s degree in Engineering

Tools

WestBond

K&S

X-ray inspection

Leak detection

Laser tools

Job description

Be visionary

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description

Teledyne Micropac is looking for a Manager of Manufacturing Process Engineering will lead a team of process and equipment engineers supporting Micropac’s high‑reliability semiconductor, hybrid microcircuit, and optoelectronic device manufacturing. This role provides on‑site technical leadership, drives process optimization, and serves as the primary escalation point for complex equipment and process issues.

What you’ll do

The essential functions and key responsibilities for the position include, but are not limited to:

• Serve as the primary technical escalation point for equipment failures, process deviations, yield excursions, and customer-driven investigations.
• Lead structured problem-solving and ensure high-quality root‑cause analysis.
• Provide guidance on semiconductor, microelectronics, and optoelectronic manufacturing processes.
• Troubleshoot and optimize automated and semi‑automated production equipment.
• Validate process changes through IQ/OQ/PQ, capability studies, and DOEs.
• Own critical manufacturing processes, ensuring stability, capability, and documentation.
• Maintain and improve SOPs, travelers, PFMEAs, control plans, and specifications.
• Ensure strong document control aligned with AS9100 and aerospace/military standards.
• Drive continuous improvement to reduce scrap, improve yields, and enhance throughput.
• Support lifecycle management of critical equipment and obsolescence planning.
• Coordinate with Facilities and Maintenance to maximize equipment uptime.
• Manage and develop a team of process and equipment engineers.
• Assign daily priorities and coach engineers to build technical capability.
• Promote disciplined engineering practices and data‑driven decision‑making.
• Manage performance reviews, training plans, and succession development.
• Partner with Operations, Quality, Planning, Continuous Improvement, and Program Management.
• Participate in audits, technical reviews, and customer discussions.

What you need

• Bachelor’s degree in Engineering (Electrical, Mechanical, Manufacturing, or similar); OR 15+ years of directly relevant manufacturing/engineering experience in lieu of degree.7+ years in semiconductor, microelectronics, or aerospace manufacturing - required
• Strong knowledge of microcircuit assembly processes and high‑reliability standards - required
• Hands‑on experience with equipment troubleshooting, metrology, SPC, and DOE - required
• Experience leading technical teams in production environments - required
• Strong analytical and diagnostic skills - required
• Hands‑on problem solving - required
• Excellent communication skills - required
• Ability to develop engineering talent - required
• High sense of urgency and ownership - required
• Experience with wire bonding, die attach, hermetic sealing, and hybrid assembly - advantage
• Familiarity with WestBond, K&S, X‑ray inspection, leak detection, and laser tools - advantage
• Experience managing CAPEX projects and process improvements - advantage

What we offer

• Competitive salary and comprehensive benefits
• Health, dental, and vision coverage
• Retirement savings plan with company match
• Paid time off and holidays
• Opportunities for professional growth and innovation
• A mission‑driven culture focused on exploration and sustainability

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non‑merit based factor made unlawful by federal, state, or local laws.