Lead Test Engineer for Automotive SoC & Co-Packaged Module

Teradar; Boston (MA); On-site; USD 180,000 - 240,000; Full time

Job summary

Teradar is seeking an experienced test engineer to own the production ATE and wafer test for a multi‑die terahertz imaging radar module. You will define test strategies, bring‑up test programs, and manage external partners from first silicon to production.

The role requires hands‑on bench and prober work, coordinating with design, DFT, reliability, and package teams to deliver qualified, production‑ready parts for automotive customers.

Qualifications

• Degree in Electrical Engineering or equivalent.
• 8–15+ years in product or test engineering for production silicon.
• Experience with AEC‑Q100 and qualification strategies.
• Strong ownership across wafer sort to production ramp.

Responsibilities

• Lead bench and ATE bring‑up of die and co‑packaged module as parts return from fab and assembly.
• Own the wafer probe and ATE plan for the module, from strategy through execution.
• Debug first‑silicon issues with design, DFT, and package teams; drive failures to root cause across analog, digital, and interconnect domains.
• Bring up the die‑to‑die link at test: link training, sideband channel behavior, BER and margining, and the known‑good‑die criteria that gate assembly.
• Define wafer sort flows and test coverage for both data conversion die and digital compute die; approve probe cards and sign‑off on bump map.
• Build known‑good‑die screening to protect module yield, including per‑die traceability and calibration data write.
• Set up wafer map handling, bin definitions, and yield reporting.

Skills

Production ATE

Wafer probe

Digital test

Analog/mixed-signal test

OSAT/contract mgmt

Education

Electrical Engineering degree

Tools

Prober hardware

Test program software

Gage R&R analysis

Job description

Teradar is seeking an experienced test engineer to own the production ATE and wafer test for a multi‑die terahertz imaging radar module. You will define test strategies, bring‑up test programs, and manage external partners from first silicon to production.

The role requires hands‑on bench and prober work, coordinating with design, DFT, reliability, and package teams to deliver qualified, production‑ready parts for automotive customers.