Lead, Semiconductor Product Engineering

Jobtailor; California (MO); On-site; USD 180,000 - 240,000; Full time

Job summary

Jobtailor seeks a senior engineering leader to head the semiconductor team focused on wafer products that meet stringent quality and performance standards. You will collaborate across design, foundry, packaging, test and reliability groups to optimize yield, quality, and cost while steering products from silicon to high-volume production.

The role emphasizes DFx initiatives, manufacturing/test strategy, and AI-driven analytics to accelerate failure identification and root-cause analysis, while

Qualifications

• MS or PhD in Electrical Engineering, Optical Physics, Photonics, or related field.
• 10+ years in semiconductor, mmWave/DSP/Silicon Photonics as a technical lead.
• 5+ years of direct people leadership.
• Experience with fabrication, wafer sort/probe, and advanced packaging (2.5D/3D).
• Mentoring skills.
• Proficiency in SPC, DOE, Six Sigma, and yield software (JMP/Spotfire).
• Experience with foundry ecosystems and OSAT partners.
• Preferred: Python, ML libraries, or enterprise AI tools.
• Executive communication and stakeholder management.

Responsibilities

• Lead an engineering team delivering semiconductor wafer products meeting Cisco quality and performance standards
• Partner with design, foundry, IC packaging, test, and reliability teams to exceed yield, quality, and cost targets
• Drive yield and quality initiatives, implement DFx principles, and manage products from initial silicon through high-volume manufacturing
• Establish manufacturing and test strategies, including DFT implementation, test hardware specifications, and test program creation
• Deliver AI-driven process transformation to improve quality, yield, and cost through test-time reduction and root-cause analysis
• Create and execute AI-powered analytics strategies to streamline product development, accelerate failure identification, and enhance yield management
• Coach and upskill engineers across career stages

Skills

Semiconductor fabrication

Wafer sort testing

Advanced packaging

2.5D/3D packaging

Python programming

Machine learning

Root cause analysis

SPC

Executive communication

Yield management

Education

MS or PhD in Electrical Engineering, Optical Physics, Photonics, or related engineering fields

Tools

JMP

Spotfire

Job description

• Lead an engineering team delivering semiconductor wafer products meeting Cisco quality and performance standards


• Partner with design, foundry, IC packaging, test, and reliability teams to exceed yield, quality, and cost targets


• Drive yield and quality initiatives, implement DFx principles, and manage products from initial silicon through high-volume manufacturing


• Establish manufacturing and test strategies, including DFT implementation, test hardware specifications, and test program creation


• Deliver AI-driven process transformation to improve quality, yield, and cost through test-time reduction and root-cause analysis


• Create and execute AI-powered analytics strategies to streamline product development, accelerate failure identification, and enhance yield management


• Coach and upskill engineers across career stages

Requirements

• MS or PhD in Electrical Engineering, Optical Physics, Photonics, or related engineering fields


• 10+ years of semiconductor industry experience in mmWave, DSP, or Silicon Photonics as a technical lead


• 5+ years of direct people leadership


• Technical expertise in semiconductor fabrication processes, wafer sort/probe testing, and advanced packaging, including 2.5D/3D, flip-chip, and optical interconnect


• Proven mentoring skills


• Mastery of Statistical Process Control (SPC), Design of Experiments, Six Sigma methodologies, and yield management software such as JMP or Spotfire


• Deep silicon engineering expertise


• Experience managing technical deliverables with leading foundry ecosystems and OSAT partners


• Preferred: experience with Python, machine learning libraries, or enterprise AI tools


• Preferred: executive communication and stakeholder management skills

Core Competencies

Demonstrates expertise in semiconductor fabrication processes, yield management, and advanced packaging techniques while leading engineering teams to achieve high-quality product standards. Proficient in AI-driven analytics and process transformation to enhance manufacturing efficiency and product development.

Highest-signal resume keywords

• Semiconductor Fabrication Processes


• Statistical Process Control (SPC)


• Design of Experiments


• People Leadership


• Yield Management Software

Hard Skills

• Semiconductor Industry Experience


• Wafer Sort/Probe Testing


• Advanced Packaging


• Machine Learning Libraries


• Python Programming


• AI-Powered Analytics


• Root-Cause Analysis


• DFT Implementation


• Test Hardware Specifications


• Failure Identification

Soft Skills

• Mentoring Skills


• Executive Communication


• Stakeholder Management

Industry Keywords

• MmWave


• DSP


• Silicon Photonics


• 2.5D/3D Packaging


• Flip-Chip


• Optical Interconnect


• Yield Initiatives


• Test Program Creation


• Foundry Ecosystems


• OSAT Partners

Tools & Technologies

• JMP


• Spotfire