Staff Package Design Engineer

Renesas Electronics; Austin (TX); On-site; USD 90,000 - 120,000; Full time

Job summary

Renesas Electronics is looking for a Staff Package Design Engineer to join our Advanced Silicon Packaging team in Austin, TX. You will design high-performance package solutions across various applications, including automotive and IoT.

The ideal candidate will have over 4 years of experience in package CAD layout, a strong background in power module packaging, and proficiency with design tools like Cadence Allegro. A Bachelor's or Master's degree in Electrical Engineering is required.

Qualifications

• 4+ years of hands-on experience in package CAD layout or advanced package development.
• Strong background in power module packaging and FCBGA.
• High proficiency with industry-standard design tools.

Responsibilities

• Execute package layout design for advanced technologies.
• Develop and maintain package CAD databases for manufacturability.
• Collaborate with teams for package-level co-optimization.

Skills

Package CAD layout

Power module packaging

Advanced substrate design

Technical documentation skills

High-speed routing

Education

Bachelor's or Master's degree in Electrical Engineering

Tools

Cadence Allegro Package Designer

Siemens Xpedition Substrate Integrator

Job description

Renesas is a global leader in microcontrollers, analog, power, and SoC products, delivering semiconductor solutions that power billions of connected, intelligent devices. As the industry shifts toward heterogeneous integration, Renesas is expanding its advanced packaging capabilities and seeking a talented Staff Package Design Engineer to join our Advanced Silicon Packaging team located in our Austin, TX or Tempe, AZ offices. In this role, you will design and deliver next‑generation, high‑performance package solutions that support our world‑class product portfolio across automotive, industrial, infrastructure, and IoT applications.

Key Responsibilities

• Execute package layout design and development for advanced package technologies, including power modules, FCBGA, SiP, WLCSP, and multi‑chip modules.
• Develop and maintain package CAD databases, ensuring accuracy and adherence to package design guidelines, DFM, and DFA requirements to support manufacturability, yield, and long‑term reliability.
• Manage the package design cycle, including schematic creation, netlist import, footprint assignment, layout implementation, verification, and generation of manufacturing release outputs such as Gerber/drill data, fabrication drawings, assembly drawings, bump maps, and related documentation.
• Create and modify substrate and RDL layouts, bump maps, escape routing, stack‑up structures, and power/ground distribution features.
• Collaborate with SI/PI, thermal, reliability, DFT, silicon design, product engineering, and manufacturing teams to support package‑level co‑optimization and participate in design reviews.
• Ensure package designs comply with applicable foundry, OSAT, substrate vendor, and manufacturing design rules, including DRC, LVS, connectivity, and netlist verification requirements.
• Support Engineering Change Order cycles, design updates, revision control, and release documentation throughout the project lifecycle.

Qualifications

• 4+ years of hands‑on experience in package CAD layout, substrate design, or advanced package development; 6+ years preferred.
• Strong background in power module packaging, FCBGA, SiP, WLCSP, advanced substrate‑based packages, and multi‑die/chiplet‑based package architectures.
• High proficiency with industry‑standard package design tools such as Cadence Allegro Package Designer / SiP Layout, Siemens Xpedition Substrate Integrator, or equivalent CAD platforms.
• Proven experience applying advanced package design rules, substrate vendor constraints, OSAT assembly requirements, DFM/DFA principles, and manufacturing release standards.
• Experience interfacing directly with Tier‑1 OSATs, substrate suppliers, foundries, silicon design teams, and product engineering teams.
• Working understanding of SI/PI fundamentals, high‑speed routing, impedance control, power/ground distribution, and crosstalk mitigation.
• Strong communication, presentation, and technical documentation skills, with demonstrated experience working effectively in global, cross‑functional engineering environments.

Education

• Bachelor's or Master's degree in Electrical Engineering, Microelectronics, Materials Science, or a related technical discipline.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual‑use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.