Senior Process Engineer

Actalent; California (MO); On-site; USD 120,000 - 180,000; Full time

Job summary

Actalent in Carlsbad, CA is seeking a Senior Process Engineer to develop, optimize, and scale advanced manufacturing and packaging processes for optoelectronic and silicon photonics products. You will lead process development for flip chip assembly and thermo-compression bonding, and support 2.5D and 3D packaging architectures.

This high-visibility role requires collaboration with optics and electronics teams, DOE studies, and travel up to 20% to partners in Asia and domestic sites to drive

Qualifications

• 5+ years of process engineering experience in semiconductor or photonics environments.
• Proven experience with flip chip packaging and die-to-wafer/wafer-level packaging.
• Experience with DOE, FMEA, yield analysis, and SPC methodologies.
• Strong analytical and cross-functional collaboration skills.

Responsibilities

• Develop, refine, and optimize manufacturing processes for optoelectronic and silicon photonics products.
• Lead packaging processes with focus on flip chip assembly and thermo-compression bonding (TCB).
• Support 2.5D and 3D packaging architectures for next-gen products.
• Coordinate with optics, electronics, and process engineering teams to design experiments and DOE studies.
• Monitor process health, yield metrics, and failure trends to drive improvements.

Skills

Flip chip packaging

Thermo-Compression Bonding

DOE

FMEA

Statistical process control

Yield analysis

Cross-functional collaboration

Packaging reliability

Education

Bachelor's degree in Engineering/Physics/Materials Science

Tools

JMP

Minitab

Job description

Job Description

Job Description

Job Title: Senior Process Engineer

Job Description

This Senior Process Engineer role focuses on developing, optimizing, and scaling advanced manufacturing and packaging processes for optoelectronic and silicon photonics products. You will lead process development for flip chip assembly and thermo-compression bonding, support 2.5D and 3D packaging architectures, and play a key role in transitioning processes from development to high-volume production. This is a high-visibility position with significant ownership and impact in a rapidly growing, well-funded startup operating in a state-of-the-art cleanroom and pilot manufacturing environment.

Responsibilities

• Develop, refine, and optimize manufacturing processes used in the assembly of optoelectronic and silicon photonics products.
• Design and implement advanced packaging processes, with a primary focus on flip chip assembly and thermo-compression bonding (TCB).
• Support the development and implementation of 2.5D and 3D packaging architectures for next-generation products.
• Work cross-functionally with optics, electronics, and process engineering teams to define experiments and execute DOE (Design of Experiments) studies aimed at improving yield, quality, and performance.
• Monitor process health, yield metrics, and failure trends to identify areas for improvement and risk mitigation.
• Perform detailed root cause analysis and process troubleshooting to resolve manufacturing issues and improve reliability.
• Create statements of work (SOWs) and project plans for new process development initiatives and continuous improvement projects.
• Collaborate closely with suppliers, subcontractors, OSATs, and contract manufacturers to align process requirements and ensure robust execution.
• Help scale manufacturing processes from development and pilot line stages into volume production, ensuring manufacturability and repeatability.
• Contribute to the buildout of pilot manufacturing lines and the implementation of advanced packaging capabilities.
• Apply statistical methods and tools to conduct yield analysis, FMEA, and statistical process control to maintain and improve process performance.
• Provide technical leadership and act as a key subject matter expert on advanced packaging within the organization.
• Support domestic and international travel, including visits to Asia, to engage with OSAT and manufacturing partners as needed (less than 20% travel).

Essential Skills

• 5+ years of process engineering experience within semiconductor, photonics, optoelectronics, or advanced manufacturing environments.
• Strong, hands-on experience with die-level flip chip packaging, specifically beyond SMT or PCB assembly.
• Proven experience with Die-to-Wafer or Wafer-Level Packaging processes.
• Thermo-Compression Bonding (TCB) experience required, including process setup, optimization, and troubleshooting.
• Demonstrated experience developing manufacturing processes and successfully bringing them to production scale.
• Working knowledge of DOE (Design of Experiments), FMEA, yield analysis, and statistical process control methodologies.
• Experience using JMP, Minitab, or similar statistical software for data analysis and process optimization.
• Understanding of packaging reliability principles and failure analysis techniques in semiconductor or photonics manufacturing.
• Ability to work effectively in a fast-paced, highly collaborative startup environment.
• Willingness to travel domestically and internationally, including occasional travel to Asia, with less than 20% total travel.

Additional Skills & Qualifications

• Background in semiconductor, optoelectronics, photonics, or advanced packaging manufacturing.
• Experience in process development and optimization for flip chip, wafer fab, and wafer-level packaging.
• Familiarity with reliability testing and qualification processes for advanced packaging technologies.
• Bachelor's degree in Engineering, Physics, Materials Science, or a related field preferred.
• Equivalent industry experience may be considered in lieu of a formal degree.
• Comfort working with cross-functional engineering teams and external manufacturing partners.
• Interest in contributing to the buildout of pilot lines and scaling advanced packaging initiatives in a startup setting.

Work Environment

This role is 100% onsite in Carlsbad, CA, within a startup environment of approximately 30 employees globally and about 12 employees onsite. You will work in a state-of-the-art cleanroom and pilot manufacturing environment alongsid