Lead Optoelectronic IC Packaging Director

Ciena; United States; On-site; USD 236,000 - 376,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

401(K) with company matching

ESPP

EAP

Job summary

Ciena is seeking an Optoelectronic IC Package Design Director to lead the xPO engineering team and drive the package development for custom photonic, analog, and digital ICs that support next generation optical modules. You will own package selection, schedules, layout, SI/PI optimization, and tapeout, interfacing with cross-functional groups and CMs for sourcing.

A BS in EE or Physics and 10+ years in IC package design are required; advanced packaging tools and SI/PI simulation experience are

Qualifications

• BS in Electrical Engineering or Physics (master’s or Ph. D degree is a plus)
• 10+ years hands on experience with IC package design experience

Responsibilities

• Own and drive advanced package selection, new product BGA configuration, and package structure
• Own and manage package development schedules
• Responsible for package layout, SI/PI optimization, design verification and tapeout
• Interface and coordinate with cross-functional groups on new product package selection, feasibility analysis and design
• Work cross-functionally, understand trade-offs, constraints, and optimize silicon floor plan, bump and package pin out
• Simulate and optimize signal and power integrity and RF performance of the package design
• Interface and work with CMs and vendors for sourcing existing designs and future product development

Skills

IC package design

Optoelectronic devices

Signal integrity

Power integrity

Layout and tapeout

Cross-functional collaboration

RF design

Thermal design

Education

Bachelor's in Electrical Engineering or Physics

Tools

Cadence APD/SIP

Xpedition Package Designer (XPD)

SIWave

HFSS

Job description

Ciena is seeking an Optoelectronic IC Package Design Director to lead the xPO engineering team and drive the package development for custom photonic, analog, and digital ICs that support next generation optical modules. You will own package selection, schedules, layout, SI/PI optimization, and tapeout, interfacing with cross-functional groups and CMs for sourcing.

A BS in EE or Physics and 10+ years in IC package design are required; advanced packaging tools and SI/PI simulation experience are