Principal SI/PI Design Engineer

Ciena; United States; On-site; USD 99,000 - 157,000; Full time

Job summary

Ciena seeks an SI/PI Design Engineer to lead electrical package design for custom photonic, analog, and digital ICs powering next-gen optical modules.

You will own package selection, SIP layout, and tapeout while coordinating with cross-functional teams to optimize silicon floor plans and pin-outs. Strong SI/PI and RF analysis are essential for success in this role.

Qualifications

• BS in Electrical Engineering or Physics is required.
• 5+ years hands-on experience with IC package design.
• Proficient in SI/PI fundamentals.

Responsibilities

• Own and drive advanced package selection and BGA configuration.
• Responsible for package/SIP layout, optimization, design verification and tapeout.
• Interface with cross-functional groups on new product package selection and feasibility.
• Work cross-functionally to optimize silicon floor plan, bump and package pin out.
• Simulate and optimize signal/power integrity and RF performance; coordinate with CM and vendors.

Skills

IC package design

SI/PI fundamentals

Education

BS in Electrical Engineering or Physics

Tools

APD/SIP

Xpedition Package Designer (XPD)

Cadence

SIWave

HFSS

Job description

As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact.

How You Will Contribute:

As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead the electrical package design for custom in-house photonic, analog, and digital ICs supporting next generation optical modules.

• Own and drive advanced package selection, new product BGA configuration and package structure
• Responsible for package/SIP layout, optimization, design verification and tapeout
• Interface and coordinate with cross-functional groups throughout Ciena on new product package selection, feasibility analysis and design
• Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out
• Simulate and optimize signal/power integrity and RF performance of the package designInterface and work with CMs and vendors for the sourcing existing designs and future product development

Must Haves:

• BS in Electrical Engineering or Physics
• 5+ years hands on experience with IC package design

Assets:

• Substrate design experience for RF, digital, high speed and mixed signal die
• Thorough understanding of signal and power integrity fundamentals
• Proficient in Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)
• Fluent in SI/PI and EM simulation tools such as SIWave, HFSS
• Experience in package design electrical review, SI/PI analysis
• Experience in package design for manufacturing reviews
• Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers
• Problem solver with strong engineering fundamentals

Pay Range:

The annual salary range for this position is $98,600 - $157,400 USD

Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available.

Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission. In addition to competitive compensation, Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time. We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.

At Ciena, we are committed to building and fostering an environment in which our employees feel respected, valued, and heard. Ciena values the diversity of its workforce and respects its employees as individuals. We do not tolerate any form of discrimination.

Ciena is anEqual Opportunity Employer, including disability and protected veteran status.

If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.