Senior Wafer Fabrication Engineer

GPD Optoelectronics Corp.; Salem (NH); On-site; USD 110,000 - 160,000; Full time

Job summary

GPD Optoelectronics Corp. in Salem, NH seeks a Senior Wafer Fabrication Engineer to manage wafer processing operations in a semi-automated wafer fab. The role includes direct oversight of processes and operators, and ongoing process optimizations.

It is a full-time, exempt position reporting to the COO and located at the Salem, NH facility. Ideal candidates will have an engineering or physics background with extensive semiconductor fabrication experience, familiarity with MILSTD and ITAR

Qualifications

• Engineering or Physics degree required.
• Experience in semiconductor fabrication and photodetector materials desired.
• Ability to meet ITAR and US export restrictions.

Responsibilities

• Oversee wafer processing and photodetector device fabrication.
• Evaluate and optimize existing processes and procedures.
• Forecast and implement upgrades for increased volume and new product production.
• Familiar with photolithography, optical coatings, wet chemical processing, metallization, RIE & PECVD thin film deposition.
• Adhere to MILSTD requirements, cleanroom protocol, and product specifications.
• Drive Lean or Six Sigma improvements.

Skills

Collaboration

Problem-solving

Lean/Six Sigma

Education

Engineering or Physics degree

Tools

Photolithography

RIE

PECVD

Job description

GPD Optoelectronics Corp. is seeking a Senior Wafer Fabrication Engineer. The Senior Fabrication Engineer will manage the wafer processing operation in a semi-automated wafer fab with several manual operations involved, direct oversight of individual processes and operators, and ongoing process optimizations. Also, the ideal candidate will be familiar with more advanced manufacturing technologies/equipment and will help guide ongoing upgrades to the facility. This full-time, exempt role will report to the COO and will be located at our Salem, NH facility. Relocation is not being offered at this time.

Essential Responsibilities:

• Strong collaboration, relationship management, and interpersonal skills
• Possess Company values of honesty, integrity, respect, commitment and open to change while modeling the Company Core Principles in all activities
• Ability to foster collaborative, cross department relationships to meet common objectives
• Problem solving ability with an organized & analytical approach
• Oversee wafer processing and photodetector device fabrication
• Evaluate and optimize existing processes and procedures
• Ability to forecast and implement upgrades for increased volume and new product production
• Familiar with Photolithography, optical coatings, wet chemical processing, metallization, RIE & PECVD thin film deposition
• Lean or Six Sigma experience
• Able to follow MILSTD requirements, cleanroom protocol, and specific product specifications
• Chemical safety

Education, Requirements, and Experience:

• Engineering or Physics degree (B.S or greater) and extensive semiconductor fabrication experience. Photodetector and IIIV material experience desired.
• Able to meet requirements to work with ITAR and US export restricted items
• Lean or Six Sigma experience is beneficial.

MISC:

• Able to lift up to 75lbs
• Travel may be required