Assembly Technician – Die Attach (Optoelectronic Manufacturing)

GPD Optoelectronics Corp.; Salem (NH); On-site; USD 42,000 - 66,000; Full time

Job summary

GPD Optoelectronics Corp. in Salem, NH, seeks an Assembly Technician – Die Attach to join our cleanroom manufacturing team. You will perform manual and automated die attach processes, ensure alignment under a microscope, and follow MIL STD 883 workmanship and process requirements.

Work closely with Engineering and Quality, handle materials with ESD discipline, document travelers and production records in our ERP system, and participate in process improvements to drive reliability and yield.

Qualifications

• Experience in microelectronics or optoelectronic assembly preferred.
• Familiar with epoxy dispense and eutectic bonding.
• Able to work under a microscope with attention to detail.
• Lift up to 30 lbs and capable of long periods standing.

Responsibilities

• Perform die attach of chips to headers or substrates using epoxy or eutectic bonding.
• Set up and operate die attach equipment following WIs and process specs.
• Align die within tight positional and rotational tolerances under microscope.
• Document process parameters and report deviations as needed.
• Provide support for engineering builds and root cause investigations.

Skills

Die Attach

Microscope inspection

Epoxy dispense

Eutectic bonding

Manual dexterity

Tools

Epoxy dispense systems

Eutectic bonding equipment

Job description

We are GROWING! Come join our momentum!!!

Our unwavering commitment to unparalleled service, responsiveness, and collaboration has led to even more opportunities and growth here at GPD!

The Assembly Technician – Die Attach is responsible for precision attachment of chips / die used in optoelectronic products within our cleanroom manufacturing environment. This role supports production operations by performing manual and automated die attach processes using epoxy and/or eutectic bonding methods, in accordance with applicable MIL STD 883 workmanship and process requirements.

The Assembly Technician works within a production team reporting to Operations, while collaborating closely with Engineering and Quality to ensure robust, repeatable processes and high reliability assemblies.

Key Responsibilities

Die Attach & Assembly

• Perform die attach of chips to TO can headers and / or ceramic substrates using manual and automated epoxy dispense systems and/or eutectic bonding processes
• Prep materials, load, set up, and operate die attach equipment per approved work instructions, travelers, and process specifications
• Accurately align die within specified positional and rotational tolerances to ensure proper device performance using both manual and automated pickandplace (AirVac, vac pen, etc.) methods
• Adjust process parameters and techniques, within documented guidelines, to achieve intended bonding results

Inspection, Quality & Process Control

• Conduct detailed visual inspection of die attach operations under microscope to MIL STD 883 criteria
• Verify bond coverage, placement accuracy, cleanliness, and overall workmanship
• Identify, document, and escalation nonconformances or process deviations
• Support engineering builds, qualification activities, and root cause investigations as required

Material Handling & Packaging

• Handle sensitive optoelectronic components using proper ESD, cleanliness, and contamination (FOD) control practices
• Maintain material traceability and part identification throughout the manufacturing process
• Package assemblies per work instructions and cleanliness standards

Collaboration & Production Support

• Work effectively in a team based production environment to meet schedule, yield, and quality objectives
• Partner closely with Engineering and Quality to implement process improvements and corrective actions
• Maintain accurate documentation, travelers, and production records using our ERP system and shop floor interface

Qualifications & Skills

• Previous experience in microelectronics or optoelectronic assembly preferred (die attach experience highly desired)
• Familiarity with epoxy dispense systems, eutectic bonding, and regulated manufacturing environments
• Strong attention to detail, steady manual dexterity, and ability to work under a microscope
• Demonstrated ability to follow detailed instructions while exercising sound judgment in process execution
• This position may require sitting for long periods at a microscope, bending, reaching, visual acuity for inspection, and lifting up to 30 lbs.

MISC

• Able to lift up to 50lbs (up to 25lbs routinely). o These activities are performed in a clean room environment which is temperature and humidity controlled.
• This position requires you to wear complete fab attire for an entire shift and meet all safety and cleanroom requirements which can include:

• Hand Hygiene, Personal Item Removal, Gowning Area Preparation
• Order of Gowning, Shoe Covers, Hair Covers, Face Masks, Coveralls/Gowns
• Gloves, Additional Garments, Final Inspection and maintaining proper protocols.

This role is restricted to U.S. persons (i.e., U.S. citizens, permanent residents, and other protected individuals under the Immigration and Naturalization Act, 8 U.S.C. 1324b(a)(3)) due to access to export-controlled technology. GPD will require proof of status prior to employment.

About GPD

At GPD Optoelectronics, we believe that by operating with integrity and trust we drive constant organizational improvement, which strengthens our relationships with our employees and customers. Customer success remains our highest priority, so we strive to deliver high-quality products on time, and provide unparalleled service, responsiveness, and collaboration.

Founded in 1973 as Germanium Power Devices Corp, we began by making high-quality germanium transistors. Since the early 1980’s we have earned our place as a trusted manufacturer of both germanium and indium gallium arsenide photodiodes. We are located in Salem, NH.