Lead HBM Physical Design Engineer

Micron Technology; Richardson (TX); On-site; USD 140,000 - 210,000; Full time

Benefits offered by this job

Medical, Dental & Vision

Paid time off

Paid holidays

Equal opportunity employer

Job summary

Micron Technology is seeking an experienced physical design engineer to drive end-to-end HBM base die development. You will own floorplanning, power planning, placement, and signoff for high-density memory designs and collaborate across memory, PHY, RTL, and packaging teams to optimize bandwidth, latency, power and yield.

The ideal candidate has 7+ years in advanced-node physical design, with tape-out experience on memory designs and strong expertise in PDN, IR/EM, and timing closure.

Qualifications

• Bachelor’s or Master’s in Electrical or Computer Engineering or related field.
• 7+ years in advanced-node physical design with tape-out on memory designs.
• Expertise in PDN, IR/EM, thermal, and signoff for high-density HBM designs.

Responsibilities

• Drive end-to-end physical design for HBM base dies from netlist to GDSII.
• Own floorplanning, power planning, placement, routing, and signoff.
• Collaborate with memory, PHY, RTL, and packaging teams on interfaces.

Skills

HBM architecture

Floorplanning

Power integrity (IR/EM)

Timing closure (STA)

Signoff experience

Problem solving

Team leadership

Education

Bachelor's or Master's in Electrical/Computer Engineering

Tools

Cadence Innovus

Synopsys ICC2 / Fusion Compiler

PrimeTime

RedHawk

Calibre DRC/LVS

Job description

Micron Technology is seeking an experienced physical design engineer to drive end-to-end HBM base die development. You will own floorplanning, power planning, placement, and signoff for high-density memory designs and collaborate across memory, PHY, RTL, and packaging teams to optimize bandwidth, latency, power and yield.

The ideal candidate has 7+ years in advanced-node physical design, with tape-out experience on memory designs and strong expertise in PDN, IR/EM, and timing closure.