Lead Embedded IoT & Firmware Engineering

Techtronic Industries

Town of Brookfield (WI)

Sur place

USD 150 000 - 210 000

Plein temps

Il y a 6 jours
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Résumé du poste

Milwaukee Tool is seeking an Engineering Manager, Embedded Firmware & Electrical Engineering (IoT Connectivity) to lead a world-class team focused on designing and delivering connected products. You will own the device connectivity architecture, strategy, and roadmap in collaboration with cross-functional partners at our Brookfield, WI headquarters.

This role drives firmware and hardware development processes, security, OTA updates, and RF/wireless performance while coordinating with cloud,

Responsabilités

  • Build, manage, and motivate a world-class team of embedded firmware and electrical engineers to deliver new-to-world connected products.
  • Own the connectivity architecture for Milwaukee Tool devices, including BLE, Wi-Fi, cellular (LTE-M/NB-IoT), and other wireless protocols, spanning hardware, firmware, and cloud/mobile interfaces.
  • Lead the end-to-end design of embedded IoT devices, from concept, requirements, and architecture through schematic/PCB design, firmware development, validation, and transition to global manufacturing.
  • Define IoT firmware strategy, including RTOS/Linux platforms, bootloaders, secure boot, over-the-air (OTA) updates, device provisioning, and fleet-management capabilities.
  • Drive device security and compliance practices, including secure key storage, encrypted communication, vulnerability management, and regulatory certification (FCC, IC, CE/RED, Bluetooth SIG, and carrier).
  • Partner with cloud, mobile app, and data teams to define device-to-cloud protocols (e.g., MQTT, CoAP, HTTPS), APIs, telemetry, and diagnostics that deliver reliable end-user experiences.
  • Own RF and wireless performance, including antenna design/selection, coexistence, range, throughput, and power-consumption trade-offs in battery-powered and harsh jobsite environments.
  • Organize and align across product teams and commercial managers to develop a robust connected-product strategy and development roadmap.
  • Drive communication with marketing, product teams, and platform engineering to capture the voice of the customer and translate it into connectivity features and user experiences.
  • Grow the team to increase project capacity while maintaining exemplary performance; recruit, develop, and retain top embedded and connectivity talent.
  • Create and manage robust project roadmaps and resource plans with converged scope; drive urgency in schedules and accountability for key project metrics.
  • Champion firmware and hardware development processes (CI/CD, automated and hardware-in-the-loop testing, code review, requirements traceability, and release management) suited to connected products.
  • Mentor and coach the team in engineering best practices including task management, root cause analysis, firmware design, circuit/PCB design, simulation, and PCBA manufacturing.
  • Lead the development of test plans, procedures, and test cases for embedded systems and connectivity subsystems, including interoperability, field, and certification testing.
  • Lead technology investigations, develop system requirements, and define future architectures and reusability strategies, including common connectivity stacks and shared building blocks across products and platforms.
  • Maintain strong awareness of competitive offerings, emerging wireless/IoT standards, and the business climate to reshape a best-in-class roadmap.
  • Quickly, effectively, and candidly frame up and escape business risks

Description du poste

Milwaukee Tool is seeking an Engineering Manager, Embedded Firmware & Electrical Engineering (IoT Connectivity) to lead a world-class team focused on designing and delivering connected products. You will own the device connectivity architecture, strategy, and roadmap in collaboration with cross-functional partners at our Brookfield, WI headquarters.

This role drives firmware and hardware development processes, security, OTA updates, and RF/wireless performance while coordinating with cloud,

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