Lead, Chip Cooling & Fast-Solver Simulation

Flexcompute Inc.; United States; Remote; USD 170,000 - 250,000; Full time

Benefits offered by this job

Medical, dental, and vision insurance

401(k) Contribution

Gym allowance

Equity

Job summary

Flexcompute is a cutting-edge technology startup delivering ultra-fast simulation to optimize design cycles in semiconductor, AI, and HPC hardware. We seek a visionary Lead to drive our entry into the chip cooling space, leveraging proprietary physics-based solvers to design advanced liquid cooling and immersion systems.

Ideal candidates will have 8+ years in thermal management for electronics, expertise in GPU-accelerated solvers, and a network within major foundries.

Qualifications

• PhD or MS in Mechanical Engineering, Applied Physics, or related field.
• 8+ years in thermal management for electronics.
• Experience leading thermal architecture for high-TDP processors or high-performance server systems.
• Strong knowledge of GPU-accelerated solvers and novel approaches.
• Deep familiarity with AI hardware roadmaps and OCP standards.

Responsibilities

• Strategy & Product Roadmap: Define how solver technology can be optimized for thermal management across microfluidics, phase-change materials, and 3D IC packaging.
• Technical Leadership: Serve as the SME for chip cooling, bridging internal developers and external hardware architects.
• Solution Architecting: Collaborate with Tier 1 semiconductor companies and Hyperscalers to solve thermal challenges using Flexcompute’s platform.
• Market Evangelism: Demonstrate superiority of fast-cycle simulation to Nvidia, Intel, TSMC, and cooling specialists.
• Team Building: Recruit and mentor a team of thermal application engineers.

Skills

Thermal management

Technical leadership

Thermal simulation

Semiconductor market

Strategic thinking

Communication

Education

PhD or MS in Mechanical Engineering

Tools

CFD tools

Job description

Flexcompute is a cutting-edge technology startup delivering ultra-fast simulation to optimize design cycles in semiconductor, AI, and HPC hardware. We seek a visionary Lead to drive our entry into the chip cooling space, leveraging proprietary physics-based solvers to design advanced liquid cooling and immersion systems.

Ideal candidates will have 8+ years in thermal management for electronics, expertise in GPU-accelerated solvers, and a network within major foundries.