Head of Chip Cooling & Fast Thermal Simulation — Equity

Flexcompute, inc.; Massachusetts; On-site; USD 180,000 - 280,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

Gym allowance

401(k) plan

Equity stake

Job summary

Flexcompute is a high-growth technology startup redefining engineering simulation for the semiconductor industry. We seek a visionary Lead to guide thermal management strategy, product roadmap, and technical direction for liquid cooling, immersion systems, and advanced heat sinks in AI and HPC hardware.

The ideal candidate holds a PhD or MS, 8+ years in thermal management for electronics, and expert-level experience with thermal simulation tools, ready to lead a team of engineers and engage with

Qualifications

• PhD or MS in Mechanical Engineering, Applied Physics, or related field with focus on Heat Transfer and Fluid Dynamics.
• 8+ years in thermal management for electronics; led thermal architecture for high-TDP processors or high-performance server systems.
• Expert-level proficiency in thermal simulation tools; ability to articulate solver approaches.
• Deep familiarity with AI hardware roadmaps and Open Compute Project standards.

Responsibilities

• Define how solver technology can be optimized for thermal management, including microfluidics and 3D IC packaging.
• Act as the primary SME for chip cooling, bridging solver developers and external hardware architects.
• Work with Tier 1 semiconductor companies and Hyperscalers to solve thermal challenges using the simulation platform.
• Demonstrate the superiority of fast-cycle simulation over legacy CFD tools to industry leaders such as Nvidia, Intel, and TSMC.
• Recruit and mentor a team of thermal application engineers to support the semiconductor portfolio.

Skills

Thermal management

Mechanical engineering

System architecture

Education

PhD or MS in Mechanical Engineering, Applied Physics or related field

Tools

Thermal simulation tools

Job description

Flexcompute is a high-growth technology startup redefining engineering simulation for the semiconductor industry. We seek a visionary Lead to guide thermal management strategy, product roadmap, and technical direction for liquid cooling, immersion systems, and advanced heat sinks in AI and HPC hardware.

The ideal candidate holds a PhD or MS, 8+ years in thermal management for electronics, and expert-level experience with thermal simulation tools, ready to lead a team of engineers and engage with