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Benefits offered by this job
Competitive compensation with equity
Medical, dental, and vision health insurance
401(k) Contribution
Gym allowance
Intelligent coworkers
Job summary
A technology startup is seeking a Lead for chip cooling to utilize proprietary physics simulation technology. The role involves defining product strategies, leading technical solutions, and collaborating with semiconductor leaders. The ideal candidate will have a PhD or MS in Mechanical Engineering or Applied Physics, with over 8 years in thermal management for high-performance systems. Benefits include competitive salary, equity, and health insurance in a friendly work environment.
Qualifications
8+ years of experience in thermal management for electronics.
Deep familiarity with AI hardware and liquid cooling technologies.
Experience leading thermal architecture for high-performance systems.
Responsibilities
Define optimization strategies for Flexcompute’s solver technology.
Act as a subject matter expert for chip cooling.
Work with Tier 1 semiconductor companies to address thermal challenges.
Demonstrate advantages of simulation technology to industry leaders.
Recruit and mentor a new team of thermal engineers.
Skills
Thermal management expertise
Proficiency in thermal simulation tools
Knowledge of heat transfer and fluid dynamics
Strategic planning and product roadmap development
Team building and mentoring
Industry networking
Education
PhD or MS in Mechanical Engineering or Applied Physics
Tools
Thermal simulation tools
Job description
A technology startup is seeking a Lead for chip cooling to utilize proprietary physics simulation technology. The role involves defining product strategies, leading technical solutions, and collaborating with semiconductor leaders. The ideal candidate will have a PhD or MS in Mechanical Engineering or Applied Physics, with over 8 years in thermal management for high-performance systems. Benefits include competitive salary, equity, and health insurance in a friendly work environment.