Lead of Thermal Systems & Simulation (Semiconductor)

Flexcompute; Watertown (MA); On-site; USD 120,000 - 150,000; Full time

Benefits offered by this job

Competitive compensation with equity

Medical, dental, and vision health insurance

401(k) Contribution

Gym allowance

Intelligent coworkers

Job summary

A technology startup is seeking a Lead for chip cooling to utilize proprietary physics simulation technology. The role involves defining product strategies, leading technical solutions, and collaborating with semiconductor leaders. The ideal candidate will have a PhD or MS in Mechanical Engineering or Applied Physics, with over 8 years in thermal management for high-performance systems. Benefits include competitive salary, equity, and health insurance in a friendly work environment.

Qualifications

• 8+ years of experience in thermal management for electronics.
• Deep familiarity with AI hardware and liquid cooling technologies.
• Experience leading thermal architecture for high-performance systems.

Responsibilities

• Define optimization strategies for Flexcompute’s solver technology.
• Act as a subject matter expert for chip cooling.
• Work with Tier 1 semiconductor companies to address thermal challenges.
• Demonstrate advantages of simulation technology to industry leaders.
• Recruit and mentor a new team of thermal engineers.

Skills

Thermal management expertise

Proficiency in thermal simulation tools

Knowledge of heat transfer and fluid dynamics

Strategic planning and product roadmap development

Team building and mentoring

Industry networking

Education

PhD or MS in Mechanical Engineering or Applied Physics

Tools

Thermal simulation tools

Job description

Description

Flexcompute is an early-stage technology startup that develops ultra-fast simulation technology to help companies to design and optimize technology products. Our award-winning products are used to design airplanes, wind turbines, quantum computing chips, VR/AR headsets, data centers, and smartphones. Our team consists of world-renowned experts in scientific computing, and we have a global team working remotely from Europe, Asia, North and South America.

Description

Flexcompute is an early-stage technology startup that develops ultra-fast simulation technology to help companies to design and optimize technology products. Our award-winning products are used to design airplanes, wind turbines, quantum computing chips, VR/AR headsets, data centers, and smartphones. Our team consists of world-renowned experts in scientific computing, and we have a global team working remotely from Europe, Asia, North and South America.

The Mission

The semiconductor industry is hitting a “thermal wall.” As chip power densities exceed 1000W, traditional design cycles are too slow to keep up. Flexcompute is looking for a visionary Lead to spearhead our entry into the chip cooling industry. You will use our proprietary, high-performance physics simulation technology to help customers design the next generation of liquid cooling, immersion systems, and advanced heat sinks for AI and HPC hardware.

Key Responsibilities

• Strategy & Product Roadmap: Define how Flexcompute’s solver technology can be optimized for thermal management, including microfluidics, phase-change materials, and 3D IC packaging.
• Technical Leadership: Act as the primary subject matter expert (SME) for chip cooling, bridging the gap between our internal solver developers and external hardware architects.
• Solution Architecting: Work directly with Tier 1 semiconductor companies and Hyperscalers to solve complex thermal challenges using Flexcompute’s simulation platform.
• Market Evangelism: Demonstrate the superiority of our fast-cycle simulation over legacy CFD tools to industry leaders at Nvidia, Intel, TSMC, and cooling specialists.
• Team Building: Eventually recruit and mentor a team of thermal application engineers to support our growing portfolio in the semiconductor space.
  
  

Requirements

• Education: PhD or MS in Mechanical Engineering, Applied Physics, or a related field with a focus on Heat Transfer and Fluid Dynamics.
• Experience: 8+ years in thermal management for electronics. You have likely led thermal architecture for high-TDP processors or high-performance server systems.
• Simulation Mastery: Expert-level proficiency in thermal simulation tools. You must understand the underlying physics well enough to articulate why a GPU-accelerated or novel solver approach is transformative.
• Industry Knowledge: Deep familiarity with the roadmap of AI hardware, OCP (Open Compute Project) standards, and the transition from air to liquid cooling.
  
  

The Ideal Candidate

• You are frustrated by the slow turnaround times of current CAE software.
• You have the network to open doors at major foundries and data center equipment manufacturers.
  
  

Benefits

• Competitive compensation with equity of a fast-growing startup.
• Medical, dental, and vision health insurance.
• 401(k) Contribution.
• Gym allowance.
• Friendly, thoughtful, and intelligent coworkers.