Lead Application Engineer - Global Electronics & SMT Expert

VSV WINS INC

Irvine (CA)

On-site

USD 108,000 - 140,000

Full time

14 days+
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Benefits offered by this job

Relocation assistance
Global travel opportunities

Job summary

VSV WINS INC in Irvine, CA is seeking a Lead Application Engineer to support circuit board encapsulant application development and field-service needs.

The role acts as a bridge between customers, field teams, and lab/application engineering, translating requirements into technical solutions, enabling new applications, and optimizing materials and assembly processes.

Travel up to 25% internationally is expected to support global manufacturing customers.

Qualifications

  • Bachelor's or Master's in Engineering, Materials Science or related field required.
  • 7+ years in R&D or Application Engineering; travel up to 25% internationally.
  • Experience with circuit board encapsulant and SMT favored.

Responsibilities

  • Support development and optimization of board-level encapsulant applications.
  • Serve as the technical interface between customers, field teams, and laboratory/application engineering groups.
  • Translate customer requirements into new applications and product development opportunities.
  • Design and administer internal screening evaluations for developmental and commercialized products.
  • Optimize material assembly and application processes.
  • Troubleshoot product and process-related issues directly with customers.

Skills

Customer engagement
Troubleshooting
Cross-functional collaboration
Global travel readiness

Education

Bachelor's or Master's degree in Engineering, Materials Science, or related discipline
Doctoral degree with 5+ years of relevant experience

Tools

Minitab
JMP

Job description

VSV WINS INC in Irvine, CA is seeking a Lead Application Engineer to support circuit board encapsulant application development and field-service needs.

The role acts as a bridge between customers, field teams, and lab/application engineering, translating requirements into technical solutions, enabling new applications, and optimizing materials and assembly processes.

Travel up to 25% internationally is expected to support global manufacturing customers.

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