Lead Application Engineer

VSV WINS INC; Irvine (CA); On-site; USD 108,000 - 140,000; Full time

Benefits offered by this job

Relocation assistance

Global travel opportunities

Job summary

VSV WINS INC in Irvine, CA is seeking a Lead Application Engineer to support circuit board encapsulant application development and field-service needs.

The role acts as a bridge between customers, field teams, and lab/application engineering, translating requirements into technical solutions, enabling new applications, and optimizing materials and assembly processes.

Travel up to 25% internationally is expected to support global manufacturing customers.

Qualifications

• Bachelor's or Master's in Engineering, Materials Science or related field required.
• 7+ years in R&D or Application Engineering; travel up to 25% internationally.
• Experience with circuit board encapsulant and SMT favored.

Responsibilities

• Support development and optimization of board-level encapsulant applications.
• Serve as the technical interface between customers, field teams, and laboratory/application engineering groups.
• Translate customer requirements into new applications and product development opportunities.
• Design and administer internal screening evaluations for developmental and commercialized products.
• Optimize material assembly and application processes.
• Troubleshoot product and process-related issues directly with customers.

Skills

Customer engagement

Troubleshooting

Cross-functional collaboration

Global travel readiness

Education

Bachelor's or Master's degree in Engineering, Materials Science, or related discipline

Doctoral degree with 5+ years of relevant experience

Tools

Minitab

JMP

Job description

Lead Application Engineer

Location: Irvine, California
Employment Type: Full-Time
Industry: Manufacturing & Production
Job Category: Engineering Industrial / Manufacturing
Experience: 7+ years
Education: Bachelor's or Master's degree
Travel: Up to 25% globally
Visa Sponsorship: Not available
Security Clearance: Not required
Relocation Assistance: Possible for an ideal candidate
Salary: $108,000- $140,000

Vendor fee:$5000( Fixed Fee)
Net Payment: 90 days
Guarantee Period: 90 days

About the Organization

Our client is a global technology and manufacturing organization focused on innovation, sustainability, and collaboration. The company develops advanced solutions used across a wide range of industries and serves customers worldwide through a portfolio of trusted brands and cutting-edge technologies.

Position Overview

The Lead Application Engineer is a strategic technical role supporting circuit board encapsulant application development and customer field-service needs.

The position serves as a key connection between customers, field teams, and laboratory/application engineering personnel. The successful candidate will translate customer requirements into technical solutions, support new application development, optimize material and assembly processes, and troubleshoot product and process-related challenges.

Approximately 50% of the role will involve collaboration with Lab/Application Engineering teams, while the remaining 50% will involve direct customer-facing technical support.

Key Responsibilities

• Support development and optimization of board-level encapsulant applications.
• Serve as the technical interface between customers, field teams, and laboratory/application engineering groups.
• Capture and translate customer requirements into new applications and product development opportunities.
• Design and administer internal screening evaluations for developmental and commercialized products.
• Optimize material assembly and application processes.
• Troubleshoot product and process-related issues directly with customers.
• Provide technical support and on-site assistance to customers globally.
• Collaborate closely with Sales, Product Development, Marketing, R&D, and other cross-functional teams.
• Support global consumer electronics manufacturing customers.
• Work with application engineering and laboratory teams to evaluate materials and processes.
• Travel internationally as needed, with travel expected to be up to 25%.
• Help identify opportunities to improve application processes and customer solutions.

Required Qualifications

• Bachelor's or Master's degree in Engineering, Materials Science, or a related discipline.
• 7+ years of professional experience in R&D or Application Engineering with a Bachelor's/Master's degree.
• Alternatively, a Doctoral degree with 5+ years of relevant experience.
• Strong knowledge of circuit board encapsulant products.
• Knowledge of Surface Mount Technology (SMT).
• Demonstrated direct customer support and engagement experience.
• Strong technical troubleshooting and problem-solving skills.
• Ability to work effectively with global, cross-functional teams.
• Willingness and ability to travel internationally up to 25%.

Preferred Qualifications

• Experience with material dispensing and printing processes.
• Knowledge of liquid application equipment and processes.
• Experience with statistical analysis tools such as Minitab or JMP.
• Experience working collaboratively across Sales, Product Development, and Marketing teams.
• Experience supporting consumer electronics manufacturing customers.

Ideal Candidate

The ideal candidate will be a technically strong Application Engineer or R&D Engineer with hands-on experience in electronics manufacturing, circuit board encapsulation, SMT, materials application, and customer technical support.

Strong customer-facing communication skills are essential, as this position requires the ability to understand complex customer challenges and translate them into practical technical solutions. The candidate should also be comfortable working with global teams and traveling internationally to support customers.