Lead Application Engineer

Inabia-Software-; Irvine (CA); On-site; USD 108,000 - 140,000; Full time

Benefits offered by this job

Relocation assistance

Job summary

Inabia-Software- in Irvine, CA, is seeking a Lead Application Engineer to lead circuit board encapsulant applications and support customers globally. This full-time role combines development, troubleshooting, and field service in a collaborative cross-functional environment.

The ideal candidate has 7+ years in R&D or application engineering, with a strong background in encapsulant products and SMT, and is willing to travel up to 25% with relocation assistance available for an ideal fit.

Qualifications

• Bachelor's or Master's in Engineering, Materials Science, or related discipline.
• 7+ years of experience in R&D or Application Engineering.
• Strong knowledge of circuit board encapsulant products and SMT.
• Proven direct customer support and global cross-functional collaboration.
• Willingness to travel internationally up to 25%.

Responsibilities

• Support development and optimization of board-level encapsulant applications.
• Act as the technical interface between customers, field teams, and lab groups.
• Translate customer requirements into new applications and product development opportunities.
• Design internal evaluations for developmental and commercialized products.
• Optimize material assembly and application processes.
• Troubleshoot product and process issues with customers.
• Provide on-site technical support to customers globally.
• Collaborate with Sales, Product Development, Marketing, and R&D teams.

Skills

Customer engagement

Troubleshooting

Cross-functional teamwork

Electronics manufacturing

SMT knowledge

Education

Bachelor's or Master's in Engineering, Materials Science, or related

Doctoral degree with 5+ years relevant experience

Tools

Minitab or JMP

Job description

Lead Application Engineer

Location:Irvine, California
Employment Type:Full-Time
Industry:Manufacturing & Production
Job Category:Engineering - Industrial / Manufacturing
Experience:7+ years
Education:Bachelor's or Master's degree
Travel:Up to 25% globally
Visa Sponsorship:Not available
Security Clearance:Not required
Relocation Assistance:Possible for an ideal candidate
Salary: $108,000- $140,000

About the Organization

Our client is a global technology and manufacturing organization focused on innovation, sustainability, and collaboration. The company develops advanced solutions used across a wide range of industries and serves customers worldwide through a portfolio of trusted brands and cutting-edge technologies.

The position is part of the organization'sAdhesive Technologiesbusiness unit, which develops adhesives, sealants, and functional coatings that help customers improve product performance, manufacturing processes, and competitive advantage. The team works closely with customers and internal technical experts to develop innovative solutions for complex manufacturing applications.

Position Overview

TheLead Application Engineeris a strategic technical role supportingcircuit board encapsulant application developmentand customer field-service needs.

The position serves as a key connection between customers, field teams, and laboratory/application engineering personnel. The successful candidate will translate customer requirements into technical solutions, support new application development, optimize material and assembly processes, and troubleshoot product and process-related challenges.

Approximately50% of the role will involve collaboration with Lab/Application Engineering teams, while the remaining50% will involve direct customer-facing technical support.

Key Responsibilities

• Support development and optimization of board-level encapsulant applications.
• Serve as the technical interface between customers, field teams, and laboratory/application engineering groups.
• Capture and translate customer requirements into new applications and product development opportunities.
• Design and administer internal screening evaluations for developmental and commercialized products.
• Optimize material assembly and application processes.
• Troubleshoot product and process-related issues directly with customers.
• Provide technical support and on-site assistance to customers globally.
• Collaborate closely with Sales, Product Development, Marketing, R&D, and other cross-functional teams.
• Support global consumer electronics manufacturing customers.
• Work with application engineering and laboratory teams to evaluate materials and processes.
• Travel internationally as needed, with travel expected to be up to 25%.
• Help identify opportunities to improve application processes and customer solutions.

Required Qualifications

• Bachelor's or Master's degree inEngineering, Materials Science, or a related discipline.
• 7+ years of professional experience in R&D or Application Engineering with a Bachelor's/Master's degree.
• Alternatively, a Doctoral degree with5+ years of relevant experience.
• Strong knowledge ofcircuit board encapsulant products.
• Knowledge ofSurface Mount Technology (SMT).
• Demonstrateddirect customer support and engagement experience.
• Strong technical troubleshooting and problem-solving skills.
• Ability to work effectively with global, cross-functional teams.
• Willingness and ability to travel internationally up to 25%.

Preferred Qualifications

• Experience withmaterial dispensing and printingprocesses.
• Knowledge ofliquid application equipment and processes.
• Experience with statistical analysis tools such asMinitab or JMP.
• Experience working collaboratively acrossSales, Product Development, and Marketing teams.
• Experience supporting consumer electronics manufacturing customers.

Ideal Candidate

The ideal candidate will be a technically strongApplication Engineer or R&D Engineerwith hands-on experience inelectronics manufacturing, circuit board encapsulation, SMT, materials application, and customer technical support.

Strong customer-facing communication skills are essential, as this position requires the ability to understand complex customer challenges and translate them into practical technical solutions. The candidate should also be comfortable working with global teams and traveling internationally to support customers.