Principal Application Engineer

Artifact Global Corporation; California (MO); On-site; USD 130,000 - 155,000; Full time

Benefits offered by this job

Relocation Assistance Available

Full Benefits

Job summary

Artifact Global Corporation in Irvine, California is seeking a Principal Application Engineer to lead KPI-driven packaging initiatives and act as the primary technical interface to flagship clients. The role requires extensive semiconductor packaging experience and a proven ability to manage a small team.

Base salary ranges from USD 130,000 to 155,000, with full-time benefits and relocation assistance possible for ideal candidates.

Qualifications

• Bachelor's degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field.
• 12+ years in semiconductor packaging or processes with people management experience.
• Strong knowledge of current and emerging packaging trends, including 2.5D and 3D packaging.
• Proven ability to work independently and lead technical discussions with customers.
• Willingness to travel up to 10% and take meetings with APAC team during off-hours.

Responsibilities

• Develop and evaluate KPI results and drive innovation and continuous improvement via data driven decisions and actions.
• Leverage semiconductor knowledge in advanced packaging (2.5D, HBM, CoWoS) to accelerate material testing and test-vehicle development.
• Primary technical interface to leading edge clients, addressing and resolving issues related to product implementation, functionality, or performance.
• Responsible for application functions and tasks to sales, marketing, PD and other business units.
• Manage a small (2-4) Application Engineering team to achieve project deliverables.

Skills

Strong communication

Project management

Customer-focused

Independent worker

Education

Bachelor's degree

Job description

Location: Irvine, California, United States

Principal Application Engineer

Industry: Manufacturing & Production

Job Category: Engineering - Industrial / Manufacturing

Compensation

• Base Salary - USD $130,000 to $155,000
• Full-time
• Benefits - Full
• Relocation Assistance Available - Possible for ideal candidate

Candidate Details

• 10+ to 15 years experience
• Seniority Level - Mid-Senior
• Management Experience Required - No
• Minimum Education - Bachelor's Degree
• Willingness to Travel - Occasionally

Dare to learn new skills, advance in your career and make an impact at our company.

What you ll do

• Develop and evaluate KPI results and drive innovation and continuous improvement via data driven decisions and actions
• Leverage semiconductor knowledge in advanced packaging e.g. 2.5D, HBM, CoWoS technical requirement and trend to accelerate material testing and test vehicle development
• Primary technical interface to leading edge clients, addressing and resolving issues related to product implementation, functionality, or performance
• Responsible for application functions and tasks to sales, marketing, PD and other business units
• Manage a small (2-4) Application Engineering team to achieve project deliverables

What makes you a good fit

• Bachelor's degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field
• 12 years of experience in semiconductor packaging or processes with people manager experience
• Solid understanding of current and emerging packaging trends, including 2.5D and 3D packaging
• Proven ability to work independently and lead technical discussions with customers
• Strong communication skills with a customer-focused, ownership-driven mindset
• Effective project and time management skills, with a consistent focus on quality and delivery
• Willingness to travel up to 10%
• Ability to take meetings with our APAC team during off-hours