New College Grad - IC Package Layout Engineer

Relha LLC; Boise, Northern (ID, KY); Hybrid; USD 65,000 - 90,000; Full time

Benefits offered by this job

Medical, Dental, Vision

Paid time off

Paid holidays

Job summary

Micron Technology is seeking a New College Grad IC Package Layout Engineer to grow skills in advanced semiconductor packaging and layout design. You will work on DDR, LPDDR, GDDR, NAND, and ASIC packages alongside experienced engineers, gaining hands-on experience from design to manufacturing.

As a recent graduate, you will contribute to layout verification, library creation, and cross-functional collaboration while leveraging AI-enabled tools and data-driven workflows to boost productivity and

Qualifications

• Bachelor's or master's degree in an engineering field.
• Graduation within the last 12 months or expected graduation prior to start date.
• Strong analytical and problem-solving skills.
• Strong verbal and written communication skills.
• Ability to work effectively in a cross-functional environment.

Responsibilities

• Develop IC package layouts for DDR, LPDDR, GDDR, NAND, and ASIC.
• Support feasibility studies and mechanical substrate layouts.
• Create and maintain PCB and IC package libraries (footprint creation).
• Participate in layout reviews and generate documentation.
• Perform DRC and validation checks for manufacturability.
• Collaborate with Package Design, SI/PI teams to deliver solutions.
• Support design automation initiatives and AI-enabled productivity.

Skills

Analytical thinking

Communication skills

Cross-functional collaboration

Education

Bachelor's/Master's in Electrical, Computer, or Mechanical Engineering

Recent graduate (≤12 months)

Tools

CAD/EDA tools

Python scripting

Job description

New College Grad - IC Package Layout Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Become a member of our distinguished team at Micron Technology, where we are redefining the use of information to enrich lives everywhere. As an early-career IC Package Layout Engineer, you will grow your technical skills while contributing to the invention and implementation of advanced semiconductor packages. These packages are used in Micron's industry-leading memory and storage products. You will work alongside experienced engineers in a collaborative environment, gaining hands‑on experience with package layout design, design verification, and manufacturing processes.

Responsibilities

Develop IC package layouts for products including DDR, LPDDR, GDDR, NAND, and ASIC.

Support feasibility studies, mechanical substrate layouts, and package design activities.

Create and maintain PCB and IC Package Libraries (footprint creation) and execute package layout processes following established methodologies.

Participate in layout reviews with cross-functional engineering teams and generate layout documentation and drawings.

Perform Build Rules Checks (DRC) and utilize validation tools to ensure design quality and manufacturability.

Collaborate with Package Design, Signal Integrity, Product Engineering, Assembly, and CAD teams to deliver quality product solutions.

Support continuous improvement and design automation initiatives.

Utilize AI‑enabled tools and data‑driven workflows to improve engineering productivity, design quality, and decision making.

Minimum Qualifications

Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related engineering field.

Graduation within the last 12 months or expected graduation prior to start date.

Strong analytical and problem‑solving skills.

Strong verbal and written communication skills.

Ability to work effectively in a collaborative, cross‑functional environment.

Preferred Qualifications

Coursework, internship, co‑op, or project experience related to PCB design, IC package design, electronics, or semiconductor technologies.

Exposure to CAD or EDA design tools.

Basic understanding of signal integrity (SI) and power integrity (PI) concepts.

Experience with scripting or automation tools such as Python or similar languages.

Demonstrated leadership through student organizations, projects, research, or internships.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.

Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.

Additionally, Micron benefits include a robust paid time‑off program and paid holidays.

For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.