Integrated Photonics Engineer: PIC Design & Tapeout Leader

Acceler8 Talent

Arlington (VA)

On-site

USD 150,000 - 220,000

Full time

14 days+
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Job summary

Acceler8 Talent in Arlington, VA is seeking an Integrated Photonics Engineer to own the complete PIC development cycle from design to tapeout. You will design active and passive photonic devices, simulate performance, review layouts, work with foundry PDKs, and characterize devices, driving the process forward with Python‑based automation.

You will collaborate across fabrication, packaging and electronics, leveraging tools like Lumerical and layout suites to deliver robust photonic chips for

Qualifications

  • Hands-on engineer with PIC tapeout experience.
  • Experience designing active and passive photonic devices.
  • Experience working with foundry PDKs and tapeout flows.
  • Ability to automate measurements and analysis with Python.
  • Ability to collaborate across fabrication, packaging and electronics.

Responsibilities

  • Designing active and passive photonic devices
  • Simulating device and circuit performance
  • Creating and reviewing PIC layouts
  • Working with foundry PDKs, DRCs and tapeout flows
  • Characterizing fabricated devices
  • Automating measurements and analysis with Python
  • Using test results to improve subsequent designs
  • Collaborating across fabrication, packaging and electronics.

Skills

PIC development
Device design
Device simulation
Python automation
Lumerical
Layout tools
Characterization setups
Independence

Tools

Lumerical
KLayout
GDSFactory
Virtuoso
Python

Job description

Acceler8 Talent in Arlington, VA is seeking an Integrated Photonics Engineer to own the complete PIC development cycle from design to tapeout. You will design active and passive photonic devices, simulate performance, review layouts, work with foundry PDKs, and characterize devices, driving the process forward with Python‑based automation.

You will collaborate across fabrication, packaging and electronics, leveraging tools like Lumerical and layout suites to deliver robust photonic chips for

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