Integrated Photonics Engineer: PIC Design & Tapeout

Beacon Photonics

Santa Barbara (CA)

On-site

USD 130,000 - 230,000

Full time

2 days ago
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Benefits offered by this job

Competitive compensation
Employee stock ownership
Health benefits
401(k) matching
Paid time off

Job summary

Beacon Photonics is building revolutionary optical microsystems and seeking an Integrated Photonics Engineer to design, lay out, and validate heterogeneous photonic ICs for next‑generation laser components and systems. You will collaborate with cross‑functional teams and external foundries to deliver prototypes and products.

The candidate will lead technical efforts, refine processes, and report to senior leadership, while shaping products for sensing, communications, and quantum applications.

Qualifications

  • PhD in physics/engineering or MS with 3+ years photonics
  • Experience simulating photonic components and circuits using physics-based models
  • Hands-on characterization of photonic and electronic devices
  • Tape-out and layout in foundries (Python, gdsfactory, Cadence)
  • Familiarity with semiconductor devices and fabrication processes

Responsibilities

  • Design, develop, and tape out photonic integrated circuits and systems
  • Simulate optical components and devices to optimise performance
  • Analyse data, generate test reports, and inform design iterations
  • Develop integration processes with external foundry partners
  • Create scalable simulation, layout, and characterisation workflows
  • Direct external vendors for prototype packaging and fabrication

Skills

Photonic simulation
Tape-out
Layout design
Semiconductor fabrication
Characterisation
Foundry collaboration

Education

PhD in physics/EE
MS with 3+ years photonics

Tools

FDTD
EME
VPI
Simulink
Python
gdsfactory
Cadence

Job description

Beacon Photonics is building revolutionary optical microsystems and seeking an Integrated Photonics Engineer to design, lay out, and validate heterogeneous photonic ICs for next‑generation laser components and systems. You will collaborate with cross‑functional teams and external foundries to deliver prototypes and products.

The candidate will lead technical efforts, refine processes, and report to senior leadership, while shaping products for sensing, communications, and quantum applications.

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