PIC Design Engineer

Conductor; Austin, Boston, San Francisco (TX, MA, CA); Hybride; USD 110 000 - 160 000; Plein temps

Résumé du poste

Conductor is seeking PIC design engineers to own and contribute to wafer-scale photonic interposer PIC development. You will tackle density versus manufacturability yields, manage process variation on large wafers, and drive solutions from concept to fabrication.

The role emphasizes deep physics insight and end-to-end PIC integration. Ideal candidates will combine experience in passive/active PIC design, high-count tapeouts, and low-loss optical coupling, with a solid grasp of the manufacturing

Qualifications

• Experience with passive and active PIC design components.
• Strong understanding of the physics behind PICs beyond simulation.
• Experience with large device count PIC tapeouts.
• Deep understanding of optical coupling and low-loss integration in manufacturing conditions.
• Understanding of the physical manufacturing process behind PICs.

Connaissances

PIC design knowledge

Passive/Active PIC design

Large device count tapeouts

Optical coupling low loss

PIC manufacturing understanding

Description du poste

We’re looking for PIC (photonic integrated circuit) design engineers to contribute to and own aspects of the wafer-scale photonic interposer PIC. This will involve solving unique problems in creative ways, such as the tension between density and manufacturability yields, dealing with process variation on large scale wafers, etc.

Ideal Candidates:

Ideal candidates will have:

• Experience with both passive and active PIC design components
• An understanding of the fundamental physics at play, not just a “simulate and turn the crank” attitude
• Experience with large device count PIC tapeouts
• Deep understanding of optical coupling in and out of the PIC, especially how to achieve very low losses under realistic manufacturing conditions (alignment, etc)
• Understanding of the physical manufacturing process behind PICs

Nice to Have:

• Experience with high speed optical communications PICs
• Experience in designing with PIC material platforms other than silicon photonics (eg InP, TFLN, SiN, polymers, glass, etc)
• Experience and knowledge of active gain chip integration (eg integrated lasers, SOAs, etc)
• Experience with large area PICs
• Understanding of sources of process variation, statistical process control, etc