Senior Photonics IC Layout & Tape-out Lead

Acceler8 Talent; Berkeley (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

Acceler8 Talent is seeking a senior Photonic IC Layout & Design Flow Engineer to own the PIC layout, verification, signoff and tape-out, connecting photonic designs with electronic IC development, packaging and silicon validation.

You will establish and drive a Cadence Photonics workflow for GlobalFoundries’ 45 nm process, coordinate component designers, and ensure a complete, manufacturable PIC delivery from layout through tape-out.

Qualifications

• At least one complete industry PIC tape-out with chip-level layout, verification and signoff.
• Strong practical experience with Cadence Photonics, Virtuoso or similar PIC flow.
• Experience building or improving design flows, not just using an existing workflow.
• Solid understanding of silicon-photonics device physics with design/simulation.
• Collaborating with electronic IC, packaging and characterization engineers.

Responsibilities

• Own chip-level layout, component integration, DRC/LVS, signoff and tape-out readiness.
• Build and improve PDK, layout and verification workflows for repeatable chip delivery.
• Make photonic design flow compatible with electronic IC work underway.
• Resolve layout and interface requirements across PICs, EICs and packaging.
• Work with measurement teams to connect silicon results with design improvements.
• Provide technical direction while remaining hands-on with implementation and verification.

Skills

Cadence Photonics

Virtuoso

PIC layout

DRC/LVS

Team leadership

Tools

PDK development

CAD tooling automation

Job description

Acceler8 Talent is seeking a senior Photonic IC Layout & Design Flow Engineer to own the PIC layout, verification, signoff and tape-out, connecting photonic designs with electronic IC development, packaging and silicon validation.

You will establish and drive a Cadence Photonics workflow for GlobalFoundries’ 45 nm process, coordinate component designers, and ensure a complete, manufacturable PIC delivery from layout through tape-out.