Infrared Wafer Process Engineer – R&D Focus

flir

Goleta (CA)

On-site

USD 91,000 - 121,000

Full time

11 days ago
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Benefits offered by this job

Competitive salary
Health insurance
401(k) with company match
Employee stock purchase plan
Tuition reimbursement
Paid time off

Job summary

Teledyne Technologies Incorporated seeks engineers for uncooled detector (FPA) R&D, focusing on wafer fab processes including plasma etch, deposition, lithography, and wet cleans. You will design and implement new processes, automate or improve existing ones, and own tooling modules while characterizing wafers with SEM/FIB-SEM.

Hands-on fabrication of pilot lots is required. The role is collaborative and multi-disciplinary, with a mix of office and cleanroom environments.

Qualifications

  • Bachelor's degree or equivalent in a related technical discipline.
  • 0-5 years of related experience is desired.
  • Proficient with Word, Excel & Outlook.
  • Ability to communicate clearly in English (written and spoken).
  • Strong data analysis skills (Excel, MATLAB, JMP, Python, SQL or equivalent).
  • Experience with inspection equipment (microscopes, FIB/SEM, interferometers).
  • Direct experience with wafer fabrication processes.

Responsibilities

  • Innovate new wafer processing methods to support technology roadmap.
  • Design and execute experiments; analyze data and document results.
  • Own tools and processing modules in the area.
  • Process pilot lots on production equipment to establish feasibility.
  • Characterize results with quantitative metrology tools.
  • Automate or improve established processes and workflows.

Skills

Data analysis
Clear communication
MATLAB
Python
SQL
Microsoft Office
FIB/SEM
Wafer fabrication
Microscopy

Education

Bachelor's degree in related technical field

Tools

FIB/SEM tools
Wafer fabrication equipment
Interferometers
Microfabrication

Job description

Teledyne Technologies Incorporated seeks engineers for uncooled detector (FPA) R&D, focusing on wafer fab processes including plasma etch, deposition, lithography, and wet cleans. You will design and implement new processes, automate or improve existing ones, and own tooling modules while characterizing wafers with SEM/FIB-SEM.

Hands-on fabrication of pilot lots is required. The role is collaborative and multi-disciplinary, with a mix of office and cleanroom environments.

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