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Teledyne Technologies Incorporated seeks engineers for uncooled detector (FPA) R&D, focusing on wafer fab processes including plasma etch, deposition, lithography, and wet cleans. You will design and implement new processes, automate or improve existing ones, and own tooling modules while characterizing wafers with SEM/FIB-SEM.
Hands-on fabrication of pilot lots is required. The role is collaborative and multi-disciplinary, with a mix of office and cleanroom environments.
Teledyne Technologies Incorporated seeks engineers for uncooled detector (FPA) R&D, focusing on wafer fab processes including plasma etch, deposition, lithography, and wet cleans. You will design and implement new processes, automate or improve existing ones, and own tooling modules while characterizing wafers with SEM/FIB-SEM.
Hands-on fabrication of pilot lots is required. The role is collaborative and multi-disciplinary, with a mix of office and cleanroom environments.