Infrared Detector Wafer FAB Process Engineer

Teledyne LeCroy Korea; Goleta (CA); On-site; USD 91,000 - 121,000; Full time

Benefits offered by this job

Health/Dental/Vision/Life Insurance

Paid Vacation/Sick Time/Holidays

401(k) with Company Match

Employee Stock Purchase Plan

Tuition Reimbursement

Team/Employee Events

Job summary

Teledyne seeks an engineer to join its uncooled detector R&D team in Goleta, CA. You will develop wafer fab processes including plasma etch, thin film deposition, lithography, and wet cleans for infrared detector designs, design and automate processes, and own tools.

Hands‑on fabrication and characterization of pilot lots, SEM/FIB‑SEM, SPC, and data analysis will be part of the role. The environment is collaborative, with a mix of office and clean room/lab.

Qualifications

• Bachelor's degree or equivalent experience in related technical discipline required.
• 0-5 years of related experience desired.
• Proficient computer skills – Word, Excel & Outlook.
• Ability to communicate clearly in written and spoken English.
• Strong data analysis skills using MATLAB, JMP, Python, SQL or equivalent is helpful.

Responsibilities

• Innovate new processes to enable the technology roadmap.
• Design and execute experiments, analyze data, draw conclusions, document, and communicate results.
• Own tools and process modules in the area.
• Establish feasibility of new processes through hands‑on processing of pilot lots on production equipment.
• Characterize results using quantitative metrology tools.
• Automate or improve established processes.
• Document methods and workflows in MES‑ready format.
• Plan for statistical process control (SPC) practices as appropriate.
• Evaluate production yield challenges and recommend improvements.

Skills

Data analysis

English communication

Semiconductor fabrication

Education

Bachelor's degree or equivalent experience

Tools

MATLAB

JMP

Python

SQL

Job description

Teledyne seeks an engineer to join its uncooled detector R&D team in Goleta, CA. You will develop wafer fab processes including plasma etch, thin film deposition, lithography, and wet cleans for infrared detector designs, design and automate processes, and own tools.

Hands‑on fabrication and characterization of pilot lots, SEM/FIB‑SEM, SPC, and data analysis will be part of the role. The environment is collaborative, with a mix of office and clean room/lab.