Infrared Wafer Fab Equipment Engineer – Reliability

flir; Goleta (CA); On-site; USD 114,000 - 151,000; Full time

Job summary

Teledyne Technologies Incorporated seeks a Wafer Fab Equipment Engineer to own and improve low-rate production tools used in plasma etch, thin film deposition, lithography, and wet processing. You will analyze data for equipment health, drive improvements, and support cross‑functional teams in a structured cleanroom production setting.

The ideal candidate has hands‑on semiconductor equipment experience, strong problem‑solving skills, and works well with Process, Maintenance and Quality teams to

Qualifications

• Minimum Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related technical discipline.
• 1–5 years of relevant experience supporting semiconductor, MEMS, or microfabrication equipment.
• Familiarity with MTBF, MTTR, OEE, SPC concepts, or structured escalation workflows.
• Strong written and verbal communication skills in English.
• Proficient computer skills, including JMP, Microsoft Word, Excel.
• Strong troubleshooting, root‑cause analysis, and problem‑solving skills.
• Hands‑on experience with semiconductor fabrication equipment (vacuum, RF plasma, motion control, wet processing).
• Experience with one or more key wafer fabrication processes.
• Familiarity with cleanroom operations and safe manufacturing environments.
• U.S. Citizenship or Permanent Resident.

Responsibilities

• Own and support assigned wafer fabrication tools and subsystems used in low-rate production.
• Troubleshoot, diagnose, and resolve equipment issues impacting safety, yield, schedule, or throughput.
• Drive reliability improvements through root cause analysis and corrective actions.
• Partner with Process Engineers to ensure tools meet process capability and control requirements.
• Support hands‑on wafer processing and recovery activities for production lots as needed.
• Collect, analyze, and trend equipment performance metrics (OEE, Uptime, MTBF, MTTR, repeat failures).
• Improve equipment diagnostics, automation, and recovery procedures to reduce unplanned downtime.
• Document equipment procedures, configurations, and workflows in MES‑ready formats.
• Ensure compliance with safety, cleanroom, and EHS requirements.
• Collaborate with Process, Maintenance, Quality, and R&D teams to support stable low-rate production execution.

Skills

Communication skills

Troubleshooting

Hands-on equipment work

Problem solving

English proficiency

Data analysis

Education

Bachelor's degree in Electrical/Mechanical/Materials/Chemical Engineering or related

Tools

JMP

Microsoft Word

Excel

Job description

Teledyne Technologies Incorporated seeks a Wafer Fab Equipment Engineer to own and improve low-rate production tools used in plasma etch, thin film deposition, lithography, and wet processing. You will analyze data for equipment health, drive improvements, and support cross‑functional teams in a structured cleanroom production setting.

The ideal candidate has hands‑on semiconductor equipment experience, strong problem‑solving skills, and works well with Process, Maintenance and Quality teams to