IC Packaging Thermal/Mechanical FEA Co-op

Skyworks; Irvine (CA); On-site; USD 36,000 - 65,000; Full time

Job summary

Skyworks is seeking a Ph.D. student to join the Packaging team as an IC Packaging Thermal/Mechanical Simulation co-op. You will focus on IC packaging process flow and reliability assessment of advanced semiconductor packages through thermal and mechanical FEA.

The internship runs Winter/Spring 2027 (January–June). You'll collaborate with design, reliability, process and product engineers; use ANSYS and Python, develop basic automation scripts, and prepare reports on warpage, stress, and

Qualifications

• Pursuing a Ph.D. degree in Mechanical Engineering, Materials Science, Aerospace Engineering, Engineering Physics, or a related field.
• Basic understanding of mechanics, heat transfer, and engineering fundamentals.
• Exposure to CAD, FEA, Python, or other engineering software is a plus.
• Strong analytical, problem-solving, and communication skills.
• Eagerness to learn semiconductor packaging technologies and simulation methodologies.

Responsibilities

• Work with engineers to understand package structures, materials, and manufacturing processes used in semiconductor packaging.
• Learn and use finite element analysis (FEA) tools such as ANSYS to evaluate package behavior under thermal and mechanical loading conditions.
• Support analysis of package warpage, stress, deformation, and temperature distribution.
• Help prepare engineering reports, presentations, and summaries of simulation findings.
• Develop basic automation scripts or data analysis tools using ANSYS APDL scripting / Python or similar software.
• Collaborate with cross-functional teams including package design, reliability, process, and product engineers.

Skills

Mechanics & heat transfer

Analytical thinking

Communication

FEA basics

Python scripting

Education

Ph.D. in Mechanical Engineering / related field

Tools

ANSYS

Python

Job description

Skyworks is seeking a Ph.D. student to join the Packaging team as an IC Packaging Thermal/Mechanical Simulation co-op. You will focus on IC packaging process flow and reliability assessment of advanced semiconductor packages through thermal and mechanical FEA.

The internship runs Winter/Spring 2027 (January–June). You'll collaborate with design, reliability, process and product engineers; use ANSYS and Python, develop basic automation scripts, and prepare reports on warpage, stress, and