IC Packaging Thermal Mechanical Simulation CoOp WinterSpring January June 2027

Skyworks; Irvine (CA); On-site; USD 36,000 - 65,000; Full time

Job summary

Skyworks is seeking a Ph.D. student to join the Packaging team as an IC Packaging Thermal/Mechanical Simulation co-op. You will focus on IC packaging process flow and reliability assessment of advanced semiconductor packages through thermal and mechanical FEA.

The internship runs Winter/Spring 2027 (January–June). You'll collaborate with design, reliability, process and product engineers; use ANSYS and Python, develop basic automation scripts, and prepare reports on warpage, stress, and

Qualifications

• Pursuing a Ph.D. degree in Mechanical Engineering, Materials Science, Aerospace Engineering, Engineering Physics, or a related field.
• Basic understanding of mechanics, heat transfer, and engineering fundamentals.
• Exposure to CAD, FEA, Python, or other engineering software is a plus.
• Strong analytical, problem-solving, and communication skills.
• Eagerness to learn semiconductor packaging technologies and simulation methodologies.

Responsibilities

• Work with engineers to understand package structures, materials, and manufacturing processes used in semiconductor packaging.
• Learn and use finite element analysis (FEA) tools such as ANSYS to evaluate package behavior under thermal and mechanical loading conditions.
• Support analysis of package warpage, stress, deformation, and temperature distribution.
• Help prepare engineering reports, presentations, and summaries of simulation findings.
• Develop basic automation scripts or data analysis tools using ANSYS APDL scripting / Python or similar software.
• Collaborate with cross-functional teams including package design, reliability, process, and product engineers.

Skills

Mechanics & heat transfer

Analytical thinking

Communication

FEA basics

Python scripting

Education

Ph.D. in Mechanical Engineering / related field

Tools

ANSYS

Python

Job description

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition ID: 78217

Job Description

The Skyworks Packaging team is looking for a IC Packaging Thermal / Mechanical Simulation co-op student. This internship will focus on integrated circuit (IC) packaging process flow and support the development and reliability assessment of advanced semiconductor packages through thermal and mechanical finite element analysis (FEA).

The internship will be for Winter/Spring (January - June 2027) timeframe.

Responsibilities

• Work with engineers to understand package structures, materials, and manufacturing processes used in semiconductor packaging.
• Learn and use finite element analysis (FEA) tools such as ANSYS to evaluate package behavior under thermal and mechanical loading conditions.
• Support analysis of package warpage, stress, deformation, and temperature distribution.
• Help prepare engineering reports, presentations, and summaries of simulation findings.
• Develop basic automation scripts or data analysis tools using ANSYS APDL scripting / Python or similar software.
• Collaborate with cross-functional teams including package design, reliability, process, and product engineers.

Required Experience and Skills

• Pursuing a Ph.D. degree in Mechanical Engineering, Materials Science, Aerospace Engineering, Engineering Physics, or a related field.
• Basic understanding of mechanics, heat transfer, and engineering fundamentals.
• Exposure to CAD, FEA, Python, or other engineering software is a plus.
• Strong analytical, problem-solving, and communication skills.
• Eagerness to learn semiconductor packaging technologies and simulation methodologies.

The typical pay range for an Engineering intern across the U.S. is currently USD $26.00 - $47.50 per hour and for a Non-Engineering intern across the U.S. is currently USD $22.50 - $42.00 per hour. Starting pay will depend on level of education, the ultimate job duties and requirements, and work location. Skyworks has different pay ranges for different work locations in the U.S.

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at [e-mail].