Thermo-Mech CFD Simulation Intern

Delos; San Jose (CA); On-site; USD 27,552 - 55,104; Full time

Benefits offered by this job

Generous housing support

Daily lunch and dinner in office

Direct mentorship from industry leaders

Job summary

Delos is seeking a Thermo-Mechanical, CFD Simulation Engineering Intern to join our Advanced IC Packaging Team in San Jose. This 12-week paid internship from June to August 2026 focuses on Chip-on-Wafer-on-Substrate package development, involving critical thermo-mechanical analysis using tools like ANSYS Mechanical APDL and ANSYS FLUENT.

You will work on developing FEA models, analyze package performance, and collaborate closely with engineering teams. Generous housing support is provided, along with direct mentorship from industry leaders.

Qualifications

• Academic or project experience with FEA/CFD tools and analysis.

Responsibilities

• Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL.
• Perform thermo-mechanical stress/strain analysis and thermal cycling simulations.
• Analyze package warpage, solder joint reliability, and interconnect stress.
• Develop CFD models using ANSYS FLUENT for solder reflow modeling.
• Collaborate with design engineering teams on package development.

Skills

Proficiency in SOLIDWORKS/NX

ANSYS Mechanical APDL

ANSYS FLUENT

Understanding of semiconductor packaging materials

Basic programming/scripting skills

Education

Pursuing a degree in Mechanical Engineering or related field

Job description

Location

San Jose

Employment Type

Full time

Location Type

On-site

Department

Architecture

About Etched

Etched is building the world’s first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.

Job Summary

We are seeking a talented Thermo-Mechanical, CFD Simulation Engineering Intern focused on Chip-on-Wafer-on-Substrate (CoWoS) package development to join our Advanced IC Packaging Team. You'll use tools like ANSYS Mechanical APDL and ANSYS FLUENT to perform critical thermo-mechanical/CFD analysis and contribute to next-generation high-performance computing systems.

Key responsibilities

• Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL
• Perform thermo-mechanical stress/strain analysis and thermal cycling simulations
• Analyze package warpage, solder joint reliability, and interconnect stress
• Develop CFD models using ANSYS FLUENT for solder reflow modeling
• Collaborate with design engineering teams on package development

You may be a good fit if you have

• Education & Experience
  • Pursuing a degree in Mechanical Engineering or related field
  • Academic or project experience with FEA/CFD tools and analysis
• Technical Skills
  • Proficiency in SOLIDWORKS/NX, ANSYS Mechanical APDL and ANSYS FLUENT
  • Understanding of semiconductor packaging materials and processes
  • Strong grasp on non-linear properties of materials (elastic-plastic, viscoelastic)
  • Familiarity with CoWoS-S/L/R, TSVs, or 2.5D/3D integration concepts
  • Basic programming/scripting skills (APDL, Python, MATLAB)

Strong candidates may have some experience with

• Knowledge of solder joint reliability and failure analysis
• Familiarity with JEDEC standards and reliability testing
• Previous internship in semiconductor industry

We encourage you to apply even if you do not believe you meet every qualification.

Program details

• 12-week paid internship (June - August 2026)
• Generous housing support for those relocating
• Daily lunch and dinner in our office
• Based at our office in San Jose, CA
• Direct mentorship from industry leaders and world-class engineers
• Opportunity to work on one of the most important problems of our time