Advanced Packaging Development Engineer

Apple, Inc.; Santa Clara (CA); On-site; USD 150,000 - 225,000; Full time

Benefits offered by this job

Employee stock programs

Medical and dental coverage

Relocation assistance

Tuition reimbursement

Job summary

Apple, Inc. in Santa Clara is seeking an experienced Packaging Development Engineer to drive next-generation 2.5D and 3D packaging integration and technology development for future products.

You will lead architecture exploration through qualification and high-volume manufacturing, collaborating with silicon design, SI/PI, thermal, and manufacturing teams. The role emphasizes advanced packaging architectures, test vehicles, reliability analysis, and external partner leadership, with a focus on

Qualifications

• Bachelor's degree in a technical discipline required.
• Experience with 2.5D/3D packaging and semiconductor integration is preferred.
• Knowledge of BEoL/MEoL interconnect processing is advantageous.
• Ability to balance package-level decisions with silicon, electrical, thermal, and manufacturing constraints.

Responsibilities

• Develop advanced packaging architectures (2.5D/3D) with hybrid bonding, interposers, microbumps, and TSVs.
• Define and execute experimental test vehicles and packaging design rules for validation.
• Assess CPI risks and resolve reliability concerns with failure analysis teams.
• Collaborate across architecture, silicon design, SI/PI, and thermal teams for system trade-offs.
• Lead external technology partners on roadmaps, process capability, and high-volume manufacturing.

Skills

2.5D/3D packaging

Hybrid bonding

Interposers

Fine-pitch microbumps

TSVs

CPI risk assessment

Cross-functional collaboration

Manufacturing ramp

Education

Bachelor's degree in a technical discipline

Job description

Apple's Advanced Packaging team is seeking an experienced Packaging Development Engineer to drive next-generation packaging integration and technology development for future products. In this role, you will lead the definition, development, and qualification of cutting-edge 2.5D and 3D packaging technologies-incorporating features such as hybrid bonding, high-density interposers, fine-pitch microbumps, and Through-Silicon Vias (TSVs).

You will work cross-functionally with silicon design, physical design, SI/PI, thermal, and manufacturing teams to guide technologies from early architecture exploration through qualification and high-volume manufacturing.

Description

In this role, you will be responsible for advanced package integration and technology development within a cross-functional team, driving novel 2.5D/3D architectures from early concept through qualification.

Responsibilities

• Develop Advanced Packaging Architectures: Lead the definition, development, and qualification of advanced packaging technologies featuring hybrid bonding, fine-pitch microbumps, interposers, and TSVs.
• Define & Execute Test Vehicles: Design experimental test vehicles, establish packaging design rules, and lead characterization to validate novel interconnect concepts and build confidence for product integration.
• Manage Chip-Package Interaction & Reliability: Assess CPI risks, correlate mechanical and thermal stress behaviors, and partner with failure analysis teams to resolve yield, material, and structural challenges.
• Drive Cross-Functional Co-Optimization: Collaborate across architecture, silicon design, SI/PI, and thermal teams to evaluate holistic system trade-offs across performance, power, reliability, and cost.
• Lead External Technology Partners: Direct foundry and OSAT partners on technology roadmaps, process capability targets, development schedules, and high-volume manufacturing ramp.

Minimum Qualifications

Bachelor's degree required

Preferred Qualifications

• Strong technical background in 2.5D/3D packaging and semiconductor integration schemes (such as hybrid bonding, interposers, fine-pitch microbumps, and TSVs).
• Solid grasp of fab BEoL/MEoL interconnect processing, wafer-level packaging, and advanced assembly flows.
• Understanding of packaging materials, thermo-mechanical reliability, and chip-package interaction failure mechanisms.
• Broad systems mindset with the ability to balance package-level choices against silicon, electrical, thermal, and manufacturing constraints.
• Experience utilizing layout, physical design, or modeling tools alongside engineering data analysis.
• Proven track record collaborating with and driving external foundries, OSATs, or material vendors.
• Excellent communication and collaboration skills across cross-functional hardware teams.

Education & Experience

Degree: B.S., M.S., or Ph.D. in Physics, Materials Science, Electrical Engineering, Mechanical Engineering, Computer Engineering, or a related technical discipline.

Pay & Benefits

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $150,400 and $225,300, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.