IC Packaging Engineer - WLP

Apple; San Francisco (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

Apple is seeking an IC Packaging Engineer to drive integration across SoC and advanced 2.5D/3D packaging projects, from trade-off studies through delivery. You will lead DOE activities and coordinate with foundry and OSAT partners to enable MP-ready packaging solutions.

The role requires deep packaging expertise and strong cross-functional collaboration across design, test, reliability, and product teams. You will manage complex technical deliverables end-to-end and act as a technical anchor

Qualifications

• MS or PhD in semiconductor packaging, materials, thermal, mechanical, or electrical modeling.
• Track record taking packages from concept to high-volume manufacturing (HVM).
• Expertise in Wafer Level Packaging, 2.5D and 3D packaging.
• Strong materials characterization knowledge.
• Broad understanding of packaging technologies and FA techniques.
• Experience with package design software (APD, Virtuoso or equivalent).
• Experience in memory packaging.
• Excellent cross-functional collaboration and supplier partnerships.
• Ability to lead multi-team projects with minimal supervision.
• Strong fundamentals in engineering physics and program management.

Responsibilities

• Drive package integration across SoC and advanced 2.5D/3D projects from architecture trade-offs to delivery.
• Manage process development and enable MP-ready packaging solutions with foundry and OSAT partners.
• Serve as technical anchor across design, test, reliability, and product teams.
• Lead DOEs and build execution; orchestrate complex multi-team programs.

Skills

Packaging expertise

Cross-functional collab

Engineering physics

Program management

Supplier partnerships

Wafer Level Packaging

2.5D/3D packaging

Memory packaging

Education

BS with 10+ years experience

Tools

APD

Virtuoso

Job description

Summary

Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a hardworking, IC Packaging Engineer with strong attention for details and love for excellence and precision to accomplish extraordinary results. In this highly impactful role, you will initiate package concepts, own and drive sophisticated package selection, new product package structure and configuration optimization. You will be responsible for packaging integration and package technology development for a variety of projects including SoC.

Description

You'll drive package integration across SoC and advanced 2.5D / 3D packaging projects, from architecture trade-off studies through characterization, modeling, and product delivery. You'll manage process development and enable MP-ready packaging solutions on product, own complex technical deliverables end-to-end, and lead DOEs and build execution with foundry and OSAT partners. You'll also serve as a technical anchor across design, test, reliability, and product teams. We're looking for a seasoned engineer with deep packaging expertise, strong cross-functional and supplier partnership skills, and a solution-oriented mindset grounded in engineering physics.

Preferred Qualifications

• MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling
• Deep experience in the Semiconductor Packaging field, with a proven track record taking packages from concept to HVM
• Established expertise in Wafer Level Packaging, 2.5D packaging, and 3D packaging technology.
• Strong knowledge in materials characterization and analysis.
• Broad understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, and FA techniques.
• Proven experience with package design software (APD, Virtuoso, or equivalent).
• Demonstrated experience in memory packaging.
• Excellent interpersonal skills, with a track record of strong business partnerships and cross-functional collaboration, including overseas suppliers.
• Ability to work independently and orchestrate complex, multi-team projects with minimal supervision.
• Solution-oriented engineer with proven fundamentals in engineering physics.
• Strong program management skills.

Minimum Qualifications

BS and 10+ years of relevant industry experience or equivalent