Hybrid ASIC Failure Analysis Engineer | Root Cause Pro

Cisco Systems, Inc.; San Jose (CA); Hybrid; USD 168,000 - 245,000; Full time

Benefits offered by this job

Hybrid work model

Job summary

Cisco Systems, Inc. in San Jose, CA, is seeking a seasoned Failure Analysis Engineer to join the Quality and Reliability team.

You will perform failure analysis on ASIC products, driving root-cause investigations and collaborating with Product Test, Design, Quality, Assembly, and Foundry teams. The role requires 8+ years in semiconductor FA, expertise across cross section, X-ray, CSAM, TDR, FIB, SEM, TEM, and IR/EMMI/OBIRCH techniques, and experience with SIL/Laser Scanning Microscopy for

Qualifications

• Bachelor's degree in Electrical/Electronics Engineering or related required.
• 8+ years of experience in semiconductor failure analysis.
• Experience with FA techniques such as cross section, X-ray, CSAM, TDR, FIB, SEM, TEM, IR/EMMI/OBIRCH.

Responsibilities

• Conduct root cause failure analysis of silicon product reliability test and field failures.
• Develop and implement standard FA processes for failure analysis using all FA equipment.
• Coordinate logistics and instructions to direct the FA process.
• Document and report failure analysis results to management.
• Function as a technical resource for FA questions.
• Develop and maintain relationships with FA service and equipment vendors.
• Interface with product, test, and design engineering to identify faults on emerging technologies.

Skills

Root cause analysis

Failure analysis

Cross section analysis

X-ray analysis

FIB/SEM/TEM

ATE fault isolation

Education

Bachelor's degree in Electrical/Electronics Engineering or related

Master's degree preferred

Tools

SIL (Solid Immersion Lens)

LSM (Laser Scanning Microscopy)

FA equipment

X-ray/CSAM tools

Job description

Cisco Systems, Inc. in San Jose, CA, is seeking a seasoned Failure Analysis Engineer to join the Quality and Reliability team.

You will perform failure analysis on ASIC products, driving root-cause investigations and collaborating with Product Test, Design, Quality, Assembly, and Foundry teams. The role requires 8+ years in semiconductor FA, expertise across cross section, X-ray, CSAM, TDR, FIB, SEM, TEM, and IR/EMMI/OBIRCH techniques, and experience with SIL/Laser Scanning Microscopy for