HBM Design Engineer Intern – AI-Driven Memory & RTL

Micron Technology; Richardson (TX); On-site; USD 34,000 - 55,000; Full time

Job summary

Micron Technology invites applicants for an HBM Design Engineer Intern role to collaborate with memory engineers on design, development, and validation of advanced HBM products. You will gain hands‑on experience with digital design, circuit design, and semiconductor development flows, working across Design, Verification, Physical Design, Product Engineering, and CAD teams.

The internship emphasizes RTL development, timing/power analysis, AI‑assisted workflows, and robust documentation.

Qualifications

• Pursuing a Bachelor's or Master's in Electrical Engineering, Computer Engineering, Computer Science, or related field.

Responsibilities

• Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry‑standard EDA tools.
• Support RTL development, circuit implementation, timing analysis, power analysis, and functional verification activities.
• Develop scripting, automation, and AI‑assisted workflows to improve design productivity, debug efficiency, and design‑flow quality.
• Participate in design reviews, technical discussions, and debugging activities, leveraging AI‑enabled analysis to accelerate root‑cause identification and engineering decision‑making.
• Document technical work, experimental results, build methodologies, and AI‑assisted insights to support collaboration and continuous improvement.

Skills

Verilog/SystemVerilog/VHDL

Python/Perl/Tcl/C/C++

Analytical reasoning

Education

Bachelors in EE/CE/CS

Masters in EE/CE/CS

Tools

VCS

Xcelium

Questa

PrimeTime

Innovus

Virtuoso

Job description

Micron Technology invites applicants for an HBM Design Engineer Intern role to collaborate with memory engineers on design, development, and validation of advanced HBM products. You will gain hands‑on experience with digital design, circuit design, and semiconductor development flows, working across Design, Verification, Physical Design, Product Engineering, and CAD teams.

The internship emphasizes RTL development, timing/power analysis, AI‑assisted workflows, and robust documentation.