HBM Design Engineering Program Lead

Micron Technology, Inc; Boise (ID); On-site; USD 120,000 - 160,000; Full time

Benefits offered by this job

Healthcare plans

Paid time-off

Paid holidays

Job summary

A leading semiconductor company in Boise is seeking a Sr Manager Design Engineering to oversee the execution of high bandwidth memory (HBM) projects. The ideal candidate will have a Bachelor's in Electrical Engineering and significant experience leading technical programs. Responsibilities include managing project timelines, coordinating with internal teams and external partners, and ensuring adherence to design standards. The position offers competitive benefits, including healthcare plans and generous PTO.

Qualifications

• Strong understanding of custom design flows and SoC/DRAM development lifecycle.
• Experience working with foundries and IP vendors.
• Ability to lead multi-functional technical programs.

Responsibilities

• Own end-to-end execution of HBM development.
• Lead design-phase engagement with foundries and IP providers.
• Define, standardize, and deploy program management tools.

Skills

Leadership

Program management

Analytical skills

Communication

Education

Bachelor’s degree in Electrical Engineering or related field

12+ years of relevant industry experience

Tools

Jira

Job description

A leading semiconductor company in Boise is seeking a Sr Manager Design Engineering to oversee the execution of high bandwidth memory (HBM) projects. The ideal candidate will have a Bachelor's in Electrical Engineering and significant experience leading technical programs. Responsibilities include managing project timelines, coordinating with internal teams and external partners, and ensuring adherence to design standards. The position offers competitive benefits, including healthcare plans and generous PTO.