HBM Design Architect - 3D Packaging & Nanotech Lead

NanoHelp; Richardson (TX); On-site; USD 120,000 - 160,000; Full time

Benefits offered by this job

Comprehensive medical, dental, and vision coverage

Paid time off and family leave

Income protection and holidays

Job summary

A leading semiconductor company located in Texas is looking for a highly skilled HBM Design Architect. This role focuses on the design and integration of advanced DRAM technologies for next-generation AI and data-intensive systems. Candidates should have over 10 years of experience in engineering/design, with expertise in nanometer CMOS, DRAM architecture, and 3D integration. Comprehensive benefits are included, along with opportunities for professional growth in nanotechnology.

Qualifications

• 10+ years in engineering/design with strong background in nanometer CMOS, DRAM architecture, and 3D integration.
• Expertise in memory array design is required.
• Familiarity with DRAM bring-up and JEDEC standards.

Responsibilities

• Lead architecture pathfinding and feasibility analysis for new HBM generations.
• Collaborate with customers to refine specifications and future designs.
• Debug pre- and post-silicon HBM issues and identify root causes.

Skills

Nanometer CMOS

DRAM architecture

3D integration

Signal integrity

High-speed clocking/interfaces

Education

BSEE or higher in nanotechnology, electrical engineering, or semiconductor engineering

Tools

FastSpice

Hspice

Job description

A leading semiconductor company located in Texas is looking for a highly skilled HBM Design Architect. This role focuses on the design and integration of advanced DRAM technologies for next-generation AI and data-intensive systems. Candidates should have over 10 years of experience in engineering/design, with expertise in nanometer CMOS, DRAM architecture, and 3D integration. Comprehensive benefits are included, along with opportunities for professional growth in nanotechnology.