HBM Customer Integration Tech Leader | AI-Driven Solutions

Micron Technology, Inc.; Boise (ID); On-site; USD 170,000 - 250,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. in Boise seeks a Senior Manager to lead HBM customer integration and act as a key technical interface between customers and internal engineering teams.

The role focuses on aligning customer requirements with HBM design, packaging, and manufacturing processes across front-end and back-end stages. The ideal candidate will have deep semiconductor product engineering experience, strong communication skills, and a track record of driving cross-functional collaboration and

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering or related field.
• 10+ years in semiconductor product engineering, system integration, or customer-facing technical roles.
• Hands-on experience with HBM architecture, packaging, and manufacturing processes.
• Ability to interpret customer system-level requirements and map them to internal design and process capabilities.
• Excellent communication and collaboration skills across technical and non-technical teams.

Responsibilities

• Develop a strong understanding of customer system architecture, application requirements, and integration challenges.
• Translate customer technical needs into actionable requirements for internal design, product engineering, and manufacturing teams.
• Provide technical mentorship on HBM architecture, signal integrity, thermal solutions, and packaging strategies.
• Develops and deploys AI systems to automate processes and tackle technical challenges.
• Work with front-end/back-end process engineering, product development, and manufacturing to ensure seamless integration.
• Lead root-cause analysis for integration issues and propose design or process optimizations.
• Lead strategy, development, deployment, and adoption of engineering capabilities powered by intelligent technology.

Skills

HBM architecture

Packaging

Customer-facing roles

System integration

Communication skills

Education

Bachelor’s or Master’s in Electrical/Computer Engineering

Job description

Micron Technology, Inc. in Boise seeks a Senior Manager to lead HBM customer integration and act as a key technical interface between customers and internal engineering teams.

The role focuses on aligning customer requirements with HBM design, packaging, and manufacturing processes across front-end and back-end stages. The ideal candidate will have deep semiconductor product engineering experience, strong communication skills, and a track record of driving cross-functional collaboration and