Hands-On Technical Program Manager — Semiconductors & Lab Ops

ProFound People

Phoenix (AZ)

On-site

USD 180,000 - 220,000

Full time

19 hours ago
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Benefits offered by this job

Equity
401k Match
Benefits

Job summary

ProFound People in the United States seeks a hands-on engineering leader for the next generation semiconductor initiative. The role is customer facing and involves collaborating with vendors, suppliers, and internal teams to refine lab processes and showcase cutting-edge technology.

You will oversee the cleanroom lab, demonstrate solutions to investors and customers, and lead engineering efforts to push boundaries in advanced packaging.

Qualifications

  • Experience in a lab environment.
  • Hands-on approach essential.
  • Background in advanced semiconductor packaging.
  • Proven ability to influence stakeholders and lead engineering teams.
  • Customer-facing experience and ability to demonstrate technologies.
  • Capable of solving problems without predefined solutions.

Responsibilities

  • Experience within advanced packaging of semiconductors.
  • Oversee day-to-day operations of cleanroom lab.
  • Conduct demonstrations for investors, potential customers, and collaborators.
  • Contribute hands-on to advancing cutting-edge technology and shaping how it is showcased.
  • Proven track record of pushing boundaries and delivering exceptional solutions.
  • Comfortable tackling problems without known solutions; strong problem-solving skills.

Skills

Lab Experience
Hands-on
Advanced Packaging
Stakeholder Influence
Engineering Leadership
Customer Facing
Vendor Relations

Job description

ProFound People in the United States seeks a hands-on engineering leader for the next generation semiconductor initiative. The role is customer facing and involves collaborating with vendors, suppliers, and internal teams to refine lab processes and showcase cutting-edge technology.

You will oversee the cleanroom lab, demonstrate solutions to investors and customers, and lead engineering efforts to push boundaries in advanced packaging.

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