Technical Program Manager

ProFound People; Phoenix (AZ); On-site; USD 180,000 - 220,000; Full time

Benefits offered by this job

Equity

401k Match

Benefits

Job summary

ProFound People in the United States seeks a hands-on engineering leader for the next generation semiconductor initiative. The role is customer facing and involves collaborating with vendors, suppliers, and internal teams to refine lab processes and showcase cutting-edge technology.

You will oversee the cleanroom lab, demonstrate solutions to investors and customers, and lead engineering efforts to push boundaries in advanced packaging.

Qualifications

• Experience in a lab environment.
• Hands-on approach essential.
• Background in advanced semiconductor packaging.
• Proven ability to influence stakeholders and lead engineering teams.
• Customer-facing experience and ability to demonstrate technologies.
• Capable of solving problems without predefined solutions.

Responsibilities

• Experience within advanced packaging of semiconductors.
• Oversee day-to-day operations of cleanroom lab.
• Conduct demonstrations for investors, potential customers, and collaborators.
• Contribute hands-on to advancing cutting-edge technology and shaping how it is showcased.
• Proven track record of pushing boundaries and delivering exceptional solutions.
• Comfortable tackling problems without known solutions; strong problem-solving skills.

Skills

Lab Experience

Hands-on

Advanced Packaging

Stakeholder Influence

Engineering Leadership

Customer Facing

Vendor Relations

Job description

$180K - $220k USD + Company Equity + 401k Match + Benefits.

Exciting opportunity for a next-gen semiconductor company

This role is customer facing. It would suit someone who has experience working directly with semiconductor equipment manufacturing vendors / suppliers.

Ideally this person will have the technical nuance & experience to refine lab process.

• Experience within a lab environment is important.
• being hands-on is VERY important.

Alongside demonstrated technical aptitude, ideally within advanced packaging. This person must have a background of influencing stakeholders / managing engineering teams.

You'll be one of the main points of contact for an expanding US operation, within a high-technology and innovation focused environment. Genuinely shaping the face of semiconductor fabrication.

Ins-&Out's for the role include:

• Experience within advanced packaging of semiconductors
• Oversee day-to-day operations of cleanroom lab
• Conduct demonstrations for investors, potential customers, and collaborators
• Contribute hands-on to advancing cutting-edge technology and shaping how it is showcased
• Proven track record of pushing boundaries and delivering exceptional solutions
• Comfortable tackling problems without known solutions; strong problem-solving skills.