Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) En[...]

Micron Technology, Inc; Boise (ID); On-site; USD 85,000 - 110,000; Full time

Job summary

Micron Technology, Inc in Boise, Idaho is looking for a Frontend Central Product Integration Engineering (cPIE) Transformative HVB Engineer/Senior Engineer to drive process improvements and collaboration across teams. This role involves optimizing performance, initiating data-driven solutions, and managing global support.

Ideal candidates should have a relevant degree and over 2 years of semiconductor industry experience with strong data analysis skills. The position includes a focus on technical knowledge in semiconductor manufacturing processes and an agile mindset.

Qualifications

• 2+ years of experience in the semiconductor industry, particularly in Product Integration Engineering.
• Strong statistical modeling, machine learning, or AI-driven yield analysis skills.
• Demonstrated ability to make data-driven decisions in a fast-paced environment.

Responsibilities

• Initiate data-driven solutions for test, design, and integration opportunities.
• Develop models to benchmark tool performance for optimization.
• Lead multi-functional teams for project execution.

Skills

Data analysis

Problem solving

Technical knowledge of semiconductor processes

Agile mindset

Education

Bachelor’s, Master’s, or PhD in Electrical Engineering, Materials Science, Physics

Tools

Y3

JMP

Python

Job description

Req ID: JR94845

Job Title

Frontend Central Product Integration Engineering (cPIE) Transformative HVB Engineer/Senior Engineer

Responsibilities

• Process & Design Improvement: Initiate data‑driven solutions to identify test, design, and integration opportunities, specifically targeting high‑value‑bits and yield optimization.
• Performance Modeling: Develop models to benchmark tool performance and implement equipment prognostics for process integration optimization.
• Strategic Collaboration: Partner with Process, Equipment, Manufacturing, and Data Science teams to prototype initiatives and demonstrate clear business value.
• Global Solution Delivery: Collaborate with Global Quality, Product Engineering, and external suppliers to deploy "Best Known Method" (BKM) solutions to production.
• Cross‑Functional Implementation: Lead multi‑functional teams to ensure seamless communication and successful project execution across global sites.
• System Optimization: Facilitate the redefinition of current methods and systems to achieve "Best in Industry" status through continuous innovation.
• Global Business Support: Manage priorities and system enhancements to improve global business processes, maintaining a high level of detail and independence.
• Agile Mindset & Availability: Demonstrate a strong growth mindset with the flexibility to support engineering teams during non‑standard hours as needed.

Minimum Qualifications

• Education: Bachelor’s, Master’s, or PhD in Electrical Engineering, Materials Science, Physics, or a related technical field.
• Experience: 2+ years of experience in the semiconductor industry, specifically within Product Integration Engineering (PIE), Test Solutions, Product Engineering, or Circuit Design.
• Data Analysis: 2+ years of experience performing data analysis and numerical experiments using tools such as Y3, JMP, or Python.
• Technical Knowledge: In‑depth understanding of semiconductor manufacturing processes, equipment, and control systems.
• Problem Solving: Proven ability to multitask, perform root‑cause analysis, and make data‑driven decisions in a fast‑paced environment.

Preferred Qualifications

• Integration: Strong understanding of Front‑End (FE) or Back‑End (BE) process and product integration.
• Advanced Analytics: Proficiency in Statistical Modeling, Machine Learning (ML), or AI‑driven yield analysis.
• Domain Expertise: Experience with DRAM, HBM (High Bandwidth Memory), or advanced packaging technologies.
• Critical Thinking: Demonstrated ability to identify process gaps and implement innovative yield improvement solutions.

Job Profile(s)

FAB Engineer 3 - FAB Engineer 4

Relocation Level: TBD

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.