Front End Central Product Integration (FE cPIE) MTS (FE)

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 90,000 - 120,000; Full time

Benefits offered by this job

Choice of medical, dental, and vision plans

Income protection programs

Robust paid time-off program

Paid holidays

Job summary

1000 Micron Technology, Inc. is seeking a highly skilled professional for process integration in Boise, Idaho. The role focuses on structural uniformity in semiconductor production with collaboration across teams to enhance performance and yield.

Candidates should have over 7 years in the semiconductor field and a relevant degree. Benefits include comprehensive health plans and generous paid time off.

Qualifications

• 7+ years of experience in a process-related role in the semiconductor industry.
• Strong knowledge of semiconductor fabrication process flows and interactions.
• Understanding of DRAM and NAND operation.

Responsibilities

• Lead process integration structural uniformity and cross-loop integration.
• Drive node-over-node integration and achieve quality targets.
• Collaborate with process owners to optimize integration structures.

Skills

Model-based problem solving

Data-driven decision making

Strong presentation skills

Excellent verbal and written communication

Interpersonal skills

Education

Bachelor’s, Master’s, or Ph.D. in Electrical Engineering

Materials Engineering

Materials Science

Physics

Chemical Engineering

Job description

About the Role

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Key Responsibilities

Lead process integration (PI) structural uniformity and cross‑loop integration for critical modules (e.g., capacitance loop), owning end‑to‑end integration strategies to resolve yield, quality, and reliability gaps. Drive physics‑ and process‑based integration solutions through close collaboration with cross‑module process owners, PI subject‑matter experts, and key suppliers to optimize integration structures and achieve BIC yield and quality targets. Develop and apply model‑based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry‑dependent effects) to diagnose structural non‑uniformity. Define, implement, and continuously strengthen critical inline monitoring and defense lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity. Own and advance product integration programs and loop‑level domain expertise, maintaining deep technical knowledge across node transitions. Proactively drive node‑over‑node “shift‑left” integration, including early implementation of uniformity, bevel, and backside best‑known‑methods (BKMs) during development phases to accelerate whole‑wafer (center‑to‑edge) yield and quality ramp. Drive worldwide technical alignment and execution excellence by leading global projects, standardizing and enhancing network BKMs, and scaling proven solutions across sites. Identify efficiency and performance gaps, and lead business process creation, optimization, and re‑engineering to improve benchmark performance, cycle time, and development efficiency.

Qualifications

• 7+ years of experience in a process‑related role in the semiconductor industry.
• Bachelor’s, Master’s, or Ph.D. in Electrical Engineering, Materials Engineering, Materials Science, Physics, or Chemical Engineering.
• Logical thinking and strong knowledge of semiconductor fabrication process flows, interactions between processes, and how changes affect yield, device performance, and reliability.
• Understanding of DRAM and NAND operation and structure to interpret parametric, probe, and qualification data from both front‑end and back‑end assembly processes.

Desired Skills

• Good model‑based problem solving with data‑driven decision making.
• Proven track record of fixing and tackling structure and device‑related issues, and addressing root cause.
• Strong presentation, organizational, and multitasking skills.
• Ability to work effectively in a team, take initiative, and assume added responsibilities.
• Excellent verbal and written communication.
• Strong interpersonal skills and ability to build customer/co‑worker relationships.
• Willingness to travel to Micron sites for face‑to‑face collaboration.

Benefits

• Choice of medical, dental, and vision plans in all locations.
• Benefit programs that protect income if unable to work due to illness or injury, and paid family leave.
• Robust paid time‑off program and paid holidays.
• Additional benefit information available in the Benefits Guide on micron.com/careers/benefits.

EEO Statement

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.