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HPSP Co., LTD is seeking a Field Service Engineer to install, service and maintain 300mm furnace systems at semiconductor facilities. You will work on site with customers, perform preventative and unscheduled maintenance, and generate service reports detailing equipment status and actions taken.
The role requires travel up to 30% and a proactive mindset for troubleshooting, with a focus on reliability and customer satisfaction. Monday–Friday schedule with occasional overtime.
HPSP is a leading manufacturer of semiconductor capital equipment for the semiconductor industry. Come join our successful team and help contribute to achieving the next level of best-in-class support for our HPAP equipment technology.
Field Service Engineer will support semiconductor equipment installation and maintenance at customer site. This position will be responsible for installation, preventative and unscheduled maintenance, and day to day running of a 300mm high pressure annealing furnace system at customer facility. The positions duties entail maintaining the complete system including the following sub systems; electronic, electrical, electro-magnetic, mechanical, pneumatic, vacuum, heating systems, gas delivery, 300mm factory automation, and wafer transfer systems. Additional responsibilities include completing field service documentation, which is utilized for tracking system reliability and customer billing. Good customer interface and communication skills are necessary for this position.
Position will report to customers manufacturing facility daily. This will be a normally scheduled day shift, Monday through Friday work schedule. Compressed workweeks may apply, and willingness to work occasional overtime. Field engineers will report to a site coordinator who will provide direction and job duties.
. Travel is 30% in this position.