Failure Analysis Technician: TEM & FIB Specialist

TSMC; San Jose (CA); On-site; USD 55,000 - 80,000; Full time

Benefits offered by this job

Medical, Dental, and Vision Plans

401(k) Retirement Savings Plan

Paid Time-Off Programs and Holidays

Job summary

TSMC is seeking a Failure Analysis Technician for its Arizona facility. This crucial role entails performing detailed failure analysis for cutting-edge semiconductor devices using advanced tools like Dual-Beam FIB and TEM.

The ideal candidate will possess an associate's degree in a relevant field, strong technical skills, and the ability to work both independently and collaboratively. Join TSMC to contribute to the continuous evolution of semiconductor technology while ensuring the highest product quality.

Qualifications

• Education in relevant scientific or engineering fields is required.
• Technical skills related to semiconductor devices are essential.
• Interpersonal skills including teamwork and independence are crucial.

Responsibilities

• Operate Dual-Beam FIB for sample preparation.
• Conduct materials analysis using SEM imaging.
• Document findings accurately to aid quality assurance.

Skills

Basic PC skills (MS Windows OS and MS Office)

Ability to work independently

Team player with a positive attitude

Ability to handle pressure

Education

Associate's degree from a Science/Engineering/Technology program

Tools

TEM for imaging and analysis

Dual-Beam FIB

Job description

TSMC is seeking a Failure Analysis Technician for its Arizona facility. This crucial role entails performing detailed failure analysis for cutting-edge semiconductor devices using advanced tools like Dual-Beam FIB and TEM.

The ideal candidate will possess an associate's degree in a relevant field, strong technical skills, and the ability to work both independently and collaboratively. Join TSMC to contribute to the continuous evolution of semiconductor technology while ensuring the highest product quality.