Failure Analysis Engineer

Insight Global; San Jose (CA); On-site; USD 170,000 - 210,000; Full time

Job summary

Insight Global seeks an experienced ASIC Failure Analysis Engineer to join the Quality and Reliability group in San Jose. You will perform failure analysis on ASIC products, collaborate with Product Test, Design, Quality, Assembly and Foundry teams, and guide root-cause investigations with strong communication skills.

The ideal candidate has a deep background in semiconductor FA techniques, data interpretation, and hands-on lab experience.

Qualifications

• Bachelor's degree in Electrical/Electronics Engineering or related; Masters preferred.
• 10+ years of experience in semiconductor failure analysis.
• Ability to write and execute FA plans and interpret results from FA techniques.
• Experience with dynamic FA using SIL and LSM setup.
• Knowledge of fault isolation using ATE, Scan/ATPG, MBIST.
• Experience with frontend/backend wafer fabrication, device physics understanding.

Responsibilities

• Conduct root cause failure analysis of silicon product reliability tests and field failures with corrective actions.
• Develop and implement standard FA processes using all FA equipment.
• Coordinate logistics to direct the failure analysis process and perform FA function systematically.
• Document and report FA results to management.
• Function as a technical resource for FA questions.
• Develop and maintain relationships with FA service and equipment vendors.

Skills

Root cause analysis

Communication

Lab troubleshooting

Team collaboration

Data interpretation

Education

Bachelor's degree in Electrical/Electronics Engineering or related

Masters preferred

Tools

X-ray

CSAM

FIB

SEM

TEM

TDR

IR/EMMI/OBIRCH

ATE

MBIST

LSM

SIL

Job description

ASIC Failure Analysis Engineer, EE background, Semiconductors,

Job Description

As a Failure Analysis Engineer, you will be part of the Quality and Reliability group, performing failure analysis of ASIC products. Should have a passion for problem solving and a strong technical background in semiconductor failure analysis techniques and root cause analysis.

This role will require high level of collaboration and interaction with Product Test Engineering, Design Engineering, Quality Engineering, Assembly Engineering and Foundry Engineering teams.

The successful candidate must be able to work well within a team and have excellent communication and organizational skills.

Experience with a variety of semiconductor failure analysis techniques and test equipment is required, along with the ability to interpret results and provide clear guidance on causes of failure.

Responsibilities

• Conduct root cause failure analysis of silicon product reliability test and field failures and propose corrective actions.
• Develop and implement standard processes for failure analysis using all types of FA equipment.
• Coordinate all the logistics and instructions to direct the failure analysis process and carry out FA function in a systematic way.
• Document and report failure analysis results to management.
• Function as a technical resource for failure analysis questions.
• Develop and maintain relationships with FA service and equipment vendors.

Requirements

Minimum

• Bachelors degree in Electrical/Electronics Engineering or related required. Masters preferred.
• 10+ years of experience in semiconductor failure analysis field.
• Proven ability to write and execute FA plans and interpretation of results from FA techniques such as: cross section, X-ray, CSAM, TDR, FIB, SEM, and TEM, IR/EMMI/OBIRCH
• Proven ability to specify hardware and implement set up for dynamic FA using SIL (Solid Immersion Lens) and LSM (Laser Scanning Microscopy).
• Working knowledge of fault isolation techniques using ATE, Scan/ATPG, MBIST.
• Design-based fault isolation, physical, electrical, and optical techniques to isolate, identify, and characterize device-level faults.
• Semiconductor technology and process knowledge (Fab, Assembly, and Advanced Packaging).
• Interface with product, test, and design engineering groups to identify and characterize faults on emerging technologies, while providing fault isolation, identification and characterization for yield/reliability failures.
• Good understanding of transistor functions and basic electronics.
• Knowledge of JEDEC IC Qualification tests and requirements is beneficial.
• Strong understanding of semiconductor device physics and behavior under various operating conditions
• Experience with semiconductor frontend fabrication, backend assembly, wafer testing, and discrete component failure analysis
• In-depth knowledge and direct experience of semiconductor Logic and Memory wafer fabrication technology and process flow
• Proven experience driving physical failure analysis with suppliers and improving manufacturing processes Innovative and Creative with troubleshooting techniques.
• Enjoy hands-on work and working in a lab environment.
• Good customer and vendor management skills.
• Ability to work well in cross-functional teams in a fast-paced, collaborative team environment.
• Ability to work independently, multi-task, and pay good attention to details.