Staff Engineer, Electrical Failure Analysis

Morgan Philips Group; Oklahoma City (OK); On-site; USD 110,000 - 150,000; Full time

Job summary

Morgan Philips Group seeks an experienced Failure Analysis Engineer to lead cutting-edge methodologies and innovations for semiconductor FA. You will mentor the next generation of talent while driving complex problem solving across a global engineering network.

The role emphasizes leadership in fault isolation, data-driven analysis, and collaboration with fab teams to resolve yield and quality challenges. Strong English communication is required.

Qualifications

• Education in electrical engineering or related fields with minimum 8 years of experience.
• Strong verbal and written English communication with presentation skills.
• Self-motivation, passion, multitasking, and organizational abilities.
• Proven analytical and problem-solving capabilities in diverse teams.

Responsibilities

• Network-wide innovation: lead development of new FA methodologies and disseminate best practices.
• Cross-functional collaboration to diagnose fab issues using advanced FA techniques and data analysis.
• Yield and quality enhancement by delivering clear analyses affecting yield and test programs.
• Yield improvement support with advanced problem solving, fixture patterns, and verification.
• Lead task forces and deliver technical reports detailing observed failure models and mechanisms.
• Act as super-user of FA equipment, driving new skill development and root-cause insights.
• Mentor and train teams through MBPS methodology, case investigations, and technical papers.
• Provide strategic advisory to leadership on team direction and critical decisions.

Skills

Communication

Problem-Solving

Leadership

Mentorship

Education

Bachelor’s/Master’s degree in Electrical Engineering or related field

Job description

Position Summary

We are seeking an experienced and visionary Failure Analysis (FA) Engineer to lead our organization in developing cutting-edge methodologies, capabilities, and innovations for advanced semiconductor failure analysis. In this role, you will act as a technical leader and super-user, driving complex problem-solving across our global engineering network while mentoring the next generation of talent.

Key Responsibilities

• Network-Wide Innovation: Lead the organization in developing new methodologies, capabilities, and innovations for failure analysis, and proliferate these best practices across the engineering network.
• Cross-Functional Collaboration: Partner with diverse engineering teams to identify, diagnose, and resolve sophisticated fab issues using novel FA techniques, statistical data analysis, and innovative problem-solving methodologies to pinpoint root causes and implement robust solutions.
• Yield & Quality Enhancement: Work closely with internal partners to understand requests, isolate complex problems, deliver clear analyses, and resolve critical fab issues affecting yield, quality, and test programs.
• Yield Improvement Support: Partner directly with Yield Improvement teams on advanced problem-solving, including Probe coverage improvement, repair optimization, pattern stress, bug optimization, and Force Fail criteria review and verification.
• Task Force Leadership: Drive or represent the team in key task force meetings, delivering clear, detailed technical reports to internal stakeholders that explain observed electrical failure models and mechanisms.
• State-of-the-Art FA Super-User: Act as a super-user of advanced failure analysis and fault isolation equipment, pioneering new skill developments and delivering deep insights into root-cause failures.
• Technical Growth & Mentorship: Strengthen organizational capabilities through active mentoring, continuous improvement projects, in-depth case investigations, MBPS methodology, structured training studies, and technical paper writing.
• Strategic Advisory: Provide expert guidance to leadership, helping shape the strategic direction and critical decisions of the team.

Essential Skills & Qualifications

• Education & Experience: Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or a related field, plus a minimum of 8 years of relevant working experience.
• Communication: Effective verbal and written communication skills in English, with strong presentation capabilities.
• Personal Attributes: Strong self-motivation, passion, exceptional multitasking capabilities, and strong organizational skills.
• Problem-Solving: Outstanding analytical and problem-solving skills with a proven track record of thriving in an inclusive and diverse team environment.

Preferred Experience

• Direct experience with DRAM manufacturing processes and other memory or advanced logic technologies.
• Strong expertise in electrical failure analysis (EFA), fault isolation, test programs, and circuit-level debugging.
• Proficiency in programming/scripting, design, product validation/simulation, and data analysis (including VLSI and semiconductor processes).
• Hands‑on experience using Cadence or other industry-standard failure analysis and fault isolation equipment and techniques.
• Familiarity with end-to-end semiconductor fabrication process flows and testing methodologies.
• Flexibility and willingness to engage in shift work as required.