F/A Engineer - Austin - Semiconductor Cooling Tech Company!

CyberCoders

Austin (TX)

On-site

USD 100,000 - 130,000

Full time

14 days+

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Benefits offered by this job

401k match
PTO
Full benefits

Job summary

CyberCoders in Austin, TX is seeking a Failure Analysis Engineer with semiconductor experience to lead FIB/SEM cross-sectioning and advanced analyses aimed at diagnosing failures.

You will work with process engineering and device teams, perform electrical probing and physical characterization, and document results with clear technical reports.

The role requires a BS/engineering degree, 3+ years in FA, and the ability to thrive in a fast-paced environment with occasional weekend work.

Qualifications

  • BS in Mechanical, Electrical engineering or similar field (MS preferred).
  • 3+ years' semiconductor FA experience using FIB/SEM.
  • Experience with AFM, EDS, EBSD is a plus.
  • Data-driven mindset with attention to detail.
  • Excellent verbal communication and technical writing skills.
  • Thrives in a fast-paced environment with occasional weekend work.

Responsibilities

  • Conduct X-sectioning, polishing, grinding, and lapping of metallographic samples to highlight microstructural features.
  • Electrical probing combined with physical characterization methods like optical inspection and SEM to identify root cause of failures.
  • Perform FIB cross-sectioning, SEM imaging, and EDS analysis on thermoelectric thin-film devices and process monitor samples.
  • Lead failure investigation workflows: define hypotheses, select analytical techniques, and drive root cause identification.
  • Correlate physical/structural findings with electrical characterization data to close the loop on device failures.
  • Document analysis results in clear technical reports with actionable process feedback.
  • Interface with process engineering and device teams to translate findings into yield improvement actions.
  • Coordinate access to university facilities (FIB/SEM, AFM, etc.), manage sample logistics.

Skills

FIB/SEM
AFM
EDS
EBSD
Data-driven mindset
Verbal communication
Technical writing
Fast-paced environment

Education

BS in Mechanical or Electrical Engineering
MS is a plus

Tools

FIB/SEM tool
AFM
EDS
EBSD

Job description

If you are a Failure Analysis Engineer with semiconductor related experience, please read on!

  • $100k - $130k base
  • Full-time/Permanent
  • Onsite in Austin TX
  • Full benefits + 401k matching + more!

Based in Austin, Texas, we specialize in thermoelectric technology and are proud tofully designand manufacture in the United States. With a team that has over 100 years of experience in solid-state cooling, thermoelectric devices and structures, and thermal management, we provide environmentally friendly, sustainable solid-state heating, cooling, and energy harvesting technologies with ground-breaking efficiencies.

We are currently seeking a talented Failure Analysis Engineer to join our cutting-edge thermoelectric engineering team in Austin, Texas. In this role, the engineer will lead and perform FIB/SEM cross-sectioning and other advanced physical analyses, applying deep technical expertise to diagnose failures and drive solutions to complex engineering challenges.

Qualifications
  • BS in Mechanical, Electrical engineering or similar field, MS is a plus
  • 3+ years' semiconductor related F/A work using FIB/SEM tool
  • Experience with other microscopy tools (AFM, EDS, EBSD) is a plus
  • Data-driven mindset with attention to detail
  • Excellent verbal communication and technical writing skills
  • Thrives in a fast-paced environment with occasional weekend work
Responsibilities
  • Conduct X-sectioning, polishing, grinding, and lapping of metallographic samples to
    highlight microstructural features.
  • Electrical probing combined with physical characterization methods like optical
    inspection (Keyence) and SEM to identify root cause of failures.
  • Perform FIB cross-sectioning, SEM imaging, and EDS analysis on thermoelectric thin-film
    devices and process monitor samples
  • Lead failure investigation workflows: define hypotheses, select appropriate analytical
    techniques, and drive root cause identification
  • Correlate physical/structural findings with electrical characterization data (IV, resistance,
    impedance) to close the loop on device failures
  • Document analysis results in clear technical reports with actionable process feedback
  • Interface directly with process engineering and device teams to translate findings into
    yield improvement actions
  • Coordinate and schedule access to university-hosted analytical facilities (FIB/SEM, AFM,
    etc.), manage sample logistics, and ensure efficient utilization of allocated tool time
  • Serve as primary liaison with university nanofabrication/characterization facility staff to
    maintain access agreements and resolve scheduling or sample preparation issues
Benefits
  • $100k - $130k base
  • 401k match
  • PTO
  • Full benefits including medical, dental, and vision
  • Opportunity for professional growth
  • Great company culture and work-life balance!
  • Much more!
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