Failure Analysis (F/A) Engineer

Sheetak, Inc.; Austin (TX); On-site; USD 90,000 - 120,000; Full time

Job summary

Sheetak, Inc. in Austin, Texas is seeking a Failure Analysis Engineer to join our thermoelectric engineering team. You will perform FIB/SEM cross sections and other physical analyses to identify root causes of device failures.

You will conduct metallographic prep, optical inspection, EDS/EBSD analyses, and coordinate with facility staff to access university facilities as needed. The role requires 3+ years in semiconductor FA and a BS in Mechanical or Electrical Engineering.

Qualifications

• BS in Mechanical or Electrical Engineering; MS is a plus.
• 3+ years semiconductor-related Failure Analysis using FIB/SEM.
• Experience with AFM, EDS, EBSD is a plus.

Responsibilities

• Perform FIB cross-sectioning, SEM imaging, and EDS analysis on thermoelectric devices and samples.
• Conduct X-sectioning, polishing, grinding, and lapping of metallographic samples to reveal microstructural features.
• Lead failure investigation workflows: define hypotheses, select analytical techniques, and drive root cause identification.
• Correlate physical/structural findings with electrical data (IV, resistance, impedance) to close the loop on device failures.
• Coordinate access to university facilities (FIB/SEM, AFM, etc.) and serve as liaison with facility staff.

Skills

FIB/SEM

X-sectioning

Electrical probing

SEM imaging

EDS analysis

AFM

EBSD

Root cause analysis

Leadership

Education

BS in Mechanical Engineering

BS in Electrical Engineering

MS preferred

Tools

FIB/SEM

AFM

EDS

EBSD

Optical inspection

Job description

Sheetak, Inc. is currently seeking a skilled Failure Analysis Engineer to join our leading-edge thermoelectric engineering team in Austin, Texas. The Failure Analysis Engineer will be responsible for FIB/SEM cross section and other physical analysis with technical expertise and leadership to address complex engineering challenges.

Responsibilities/Skills

• Conduct X-sectioning, polishing, grinding, and lapping of metallographic samples to highlight microstructural features.
• Electrical probing combined with physical characterization methods like optical inspection (Keyence) and SEM to identify root cause of failures.
• Perform FIB cross-sectioning, SEM imaging, and EDS analysis on thermoelectric thin-film devices and process monitor samples.
• Lead failure investigation workflows: define hypotheses, select appropriate analytical techniques, and drive root cause identification.
• Correlate physical/structural findings with electrical characterization data (IV, resistance, impedance) to close the loop on device failures.
• Coordinate and schedule access to university-hosted analytical facilities (FIB/SEM, AFM, etc.) and serve as primary liaison with facility staff.

Qualifications

• BS in Mechanical, Electrical Engineering or similar field, MS is a plus.
• 3+ years semiconductor-related F/A work using FIB/SEM tool.
• Experience with other microscopy tools (AFM, EDS, EBSD) is a plus.