Ocotillo Failure Analysis Technician - TEM Prep

Intel; Phoenix (AZ); On-site; USD 52,000 - 75,000; Full time

Job summary

Intel in Phoenix is seeking a Product Failure Analysis Technician to identify and analyze failures across electrical, thermal, mechanical and packaging domains. You will prepare TEM samples and operate failure-analysis tools, collaborating with engineers to ensure high-quality TEM analysis and accurate lab execution.

This is an excellent early-career opportunity to gain hands-on experience in semiconductor failure analysis, microscopy techniques and high-volume lab operations, with emphasis on

Qualifications

• High School diploma or AA/AS with hands-on failure analysis or related experience.
• Experience with electron microscopy, polishing, or similar analysis techniques.
• Ability to follow procedures and report results clearly.

Responsibilities

• Prepare TEM samples using FIB/PFIB for site-specific analysis.
• Operate lab tools including SEM, FIB/PFIB, and optical imaging systems.
• Perform wafer handling, coating, and pre-treatment for TEM workflows.
• Document processes and maintain lab safety and records.

Skills

Team collaboration

Problem solving

Effective communication

Education

High School diploma or AA/AS

Tools

Electron microscopy

SEM / FIB tools

TEM sample prep

Job description

Job Details

The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful.

As a Product Failure Analysis Technician, you will play a pivotal role in identifying and analyzing electrical, thermal, mechanical, package, or component failures within our products. In this role, you will perform TEM sample preparation and lab operations using state-of-the-art failure analysis tools. You will work closely with engineers to enable high-quality TEM analysis by preparing precise, site-specific samples and maintaining strong lab execution.

This is an excellent opportunity for early-career candidates to gain hands-on experience in semiconductor failure analysis, advanced microscopy techniques, and high-volume lab operations.

Business group

You will join a dynamic team within Intel's manufacturing and engineering organization, where the focus is on driving innovation, ensuring product reliability, and enhancing operational efficiency. This group plays an essential role in advancing Intel's mission to deliver cutting-edge technologies that power the modern world. By analyzing product performance and identifying solutions to improve overall quality, the team helps support Intel's commitment to delivering industry-leading products.

Key Responsibilities

• Prepare TEM samples using Dual Beam FIB/PFIB and related techniques for site‑specific analysis
• Operate lab tools including SEM, FIB/PFIB, and optical imaging systems for material analysis and sample prep
• Perform wafer handling, coating, and pre-treatment processes to support TEM workflows
• Execute sample fabrication steps based on schematics, layouts, and engineering instructions
• Partner with engineers and analysts to ensure samples meet quality and turnaround expectations
• Support lab sustaining activities including safety, tool maintenance, and process documentation
• Participate in process improvements, BKM development, and cross‑training on new techniques
• Maintain accurate documentation and follow standard operating procedures

Your responsibilities will include but not be limited to:

• Operate lab instruments to support high volume manufacturing of advanced technology nodes:
• Hands on handling Silicon Wafer/pieces.
• Operates lab tools, such as sputter coaters and spin coaters for sample pre‑treatment.
• Operates Dual Beam FIB/PFIB to perform site‑specific cross‑sectioning and prepare TEM samples, including site marking, depositing protective materials, de‑layering, imaging and TEM lamella preparation.
• Operates SEM for imaging and material analysis.
• Works from schematics, diagrams, written and verbal descriptions, layouts or plans to perform moderately complex sample fabrication procedures.
• Participate in safety forums, lab sustaining and development, process transfer, tool ownership, BKM development, and cross training on other techniques.
• Willing to work compressed shift with 12hr shift.
• Ability to lift and carry up to 50 lb.
• Long time standing and walking occasionally.

Qualifications

Minimum Qualifications

• High School diploma with 1+ years of hands‑on experience in failure analysis, product testing, or a related domain OR an AA/AS degree with no prior professional experience.
• Demonstrated expertise in utilizing analysis tools such as electron microscopy, mechanical polishing, or similar techniques through coursework, academic projects, internships, or hands‑on training.
• Proficiency in tracking and reporting systems for failure analysis cases.
• Basic mechanical aptitude and ability to follow detailed procedures
• US citizenship required
• Ability to obtain and maintain a US Government Security Clearance

Preferred Qualifications

• Strong communication and collaboration skills demonstrated through team projects or professional settings.
• A passion for innovation, problem‑solving, and contributing to process improvements.
• Ability to learn and adapt quickly to new methodologies and tools in the field of failure analysis.
• Associate's degree or technical certification in a related field