EMIB-T Substrate Tech Integration Lead

Intel; Phoenix (AZ); On-site; USD 89,000 - 171,000; Full time

Benefits offered by this job

Stock bonuses

Health, retirement, and vacation

Job summary

Intel in the United States (Arizona, Phoenix) is seeking an experienced engineer to lead EMIB-T substrate technology development and qualification efforts. You will coordinate with suppliers and cross-functional teams to ensure readiness for rising customer demand.

The role requires a strong background in advanced packaging and supplier management, with proven ability to drive projects in TD/high-volume manufacturing environments and to work effectively in global teams.

Qualifications

• Bachelor's degree with 6+ years experience, or Master's with 4+ years of experience, or PhD with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.
• Experience managing complex projects and deliver results in TD/high-volume manufacturing environments.
• Strong foundation in advanced packaging, substrates, or semiconductor manufacturing; leadership in supplier management or technology enablement.

Responsibilities

• Lead EMIB-T substrate technology development and qualification activities, ensuring suppliers achieve the required readiness to support growing customer demand.
• Drive technical enablement, manage readiness milestones, and collaborate closely with cross functional engineering teams, suppliers, and assembly platform partners.

Skills

Project management

Supplier management

Cross-functional collaboration

Problem-solving

Education

Bachelor's degree in a related technical field

Master's degree in a related field

PhD in a related field

Tools

X-ray

SEM

FTIR

EDX

Job description

Intel in the United States (Arizona, Phoenix) is seeking an experienced engineer to lead EMIB-T substrate technology development and qualification efforts. You will coordinate with suppliers and cross-functional teams to ensure readiness for rising customer demand.

The role requires a strong background in advanced packaging and supplier management, with proven ability to drive projects in TD/high-volume manufacturing environments and to work effectively in global teams.