EMIB-T Yield Lead: Advanced Packaging & AI Analytics

Intel Corporation; Chandler (AZ); On-site; USD 181,000 - 255,000; Full time

Job summary

Intel Corporation in the United States (Arizona) seeks an EMIB‑T Substrate Yield Lead to own end-to-end yield performance for EMIB‑T development and manufacturing readiness across IFS and IPG. You will drive defect reduction, data‑driven decisions, and cross‑functional collaboration to meet program milestones.

Successful candidates will bring advanced packaging, yield engineering experience, and hands‑on analytics including AI/ML defect detection.

Qualifications

• Masters degree with 6+ years or PhD with 4+ years in Engineering, Materials Science, Physics, Chemistry, Data Science, or related field.
• 5+ years of experience in semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, process engineering, or related field.
• Hands‑on experience in substrate, advanced packaging, or semiconductor yield engineering with statistical analysis, defect reduction, and process optimization.

Responsibilities

• Own end-to-end substrate yield performance for EMIB‑T development and manufacturing readiness.
• Drive DFM/DFY engagement and yield improvement plans from signal identification through execution.
• Lead daily yield huddles and cross‑functional reviews to ensure program execution and address yield risks with urgency.
• Identify and close critical yield, reliability, process, and supplier issues with minimal oversight.
• Partner with substrate suppliers, module engineers, manufacturing teams, design teams, and QA/ Reliability organizations to meet milestones.
• Establish accountability, track actions, and ensure commitments are delivered on schedule.
• Drive yield readiness assessments, risk mitigation plans, and executive communications for program reviews.
• Define and scale yield intelligence infrastructure including dashboards, analytics, computer vision, and AI/ML defect detection.

Skills

Statistical analysis

DFM/DFY

Process optimization

AI/ML defect detection

Defect reduction

Data-driven decisions

Education

Masters degree in Engineering

PhD in a related field

Tools

Dashboards

Computer vision

Image analytics

Job description

Intel Corporation in the United States (Arizona) seeks an EMIB‑T Substrate Yield Lead to own end-to-end yield performance for EMIB‑T development and manufacturing readiness across IFS and IPG. You will drive defect reduction, data‑driven decisions, and cross‑functional collaboration to meet program milestones.

Successful candidates will bring advanced packaging, yield engineering experience, and hands‑on analytics including AI/ML defect detection.